公开(公告)号：US20150102413A1

公开(公告)日：2015-04-16

申请号：US14505788

申请日：2014-10-03

Applicant: Raheel AZMAT ,  RWIK SENGUPTA ,  CHULHONG PARK ,  KWANYOUNG CHUN

Inventor： Raheel AZMAT ,  RWIK SENGUPTA ,  CHULHONG PARK ,  KWANYOUNG CHUN

IPC: H01L27/24 ,  H01L23/538

CPC classification number: H01L27/11807 ,  H01L23/535 ,  H01L23/5384 ,  H01L27/0207 ,  H01L29/0649 ,  H01L2924/0002 ,  H03K19/1736 ,  H01L2924/00

Abstract: Provided is a semiconductor device including a substrate with a plurality of logic cells, transistors provided in the plurality of logic cells, contact plugs connected to electrodes of the transistors, first via plugs in contact with top surfaces of the contact plugs, and first wires in contact with top surfaces of the first via plugs. The first wires may include a common conductive line connected to the plurality of logic cells through the contact plugs, and all of the first wires may be shaped like a straight line extending parallel to a specific direction.

Abstract translation: 提供了一种半导体器件，其包括具有多个逻辑单元的衬底，设置在多个逻辑单元中的晶体管，连接到晶体管的电极的接触插塞，与接触插塞的顶表面接触的第一通孔插头， 与第一通孔插头的顶表面接触。 第一导线可以包括通过接触插头连接到多个逻辑单元的公共导线，并且所有第一导线可以形状为平行于特定方向延伸的直线。