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公开(公告)号：US07289321B2
公开(公告)日：2007-10-30
申请号：US10989923
申请日：2004-11-16
IPC分类号： H05K7/20
CPC分类号： H05K7/20172
摘要： The present invention provides a ventilated casing for an electronic device. The ventilated casing includes a housing which has a ventilation inlet and a ventilation outlet. The ventilated casing also includes a high speed fan for moving air from the ventilation inlet to the ventilation outlet to dissipate heat that in use is generated by electronic components positioned in the housing. The fan has a blade, a motor and an air guiding portion positioned near the blade. The ventilated casing further includes a suspension for suspending the fan relative to the housing and for damping transmission of vibration originating from the fan.
摘要翻译： 本发明提供一种用于电子设备的通风外壳。 通风外壳包括具有通风口和通风口的外壳。 通风外壳还包括用于将空气从通风入口移动到通风出口的高速风扇，以散发在使用中由位于壳体中的电子部件产生的热量。 风扇具有叶片，马达和位于叶片附近的空气引导部分。 通风外壳还包括用于使风扇相对于壳体悬挂并用于阻止来自风扇的振动的传递的悬架。
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公开(公告)号：US20050259393A1
公开(公告)日：2005-11-24
申请号：US11131710
申请日：2005-05-18
申请人： Wade Vinson , Jeffery Giardina , Joseph Allen , Christopher Malone , Chandrakant Patel , David Paquin , Rich Bargerhuff
发明人： Wade Vinson , Jeffery Giardina , Joseph Allen , Christopher Malone , Chandrakant Patel , David Paquin , Rich Bargerhuff
CPC分类号： H05K7/20727 , G06F1/20
摘要： A computer system comprising a plurality of electronic components disposed within a chassis. The electronic components generate a cooling load of at least 50 CFM at 2 inches of water or greater. An air mover is disposed within said chassis and is operable to generate airflow of at least 50 CFM at 2 inches of water or greater. An air distribution system is coupled to the air mover and is operable to distribute the airflow to the plurality of electronic components.
摘要翻译： 一种包括设置在底盘内的多个电子部件的计算机系统。 电子部件在2英寸水或更大的温度下产生至少50CFM的冷却负荷。 空气移动器设置在所述底盘内，并且可操作以产生至少50CFM的气流，2英寸水或更大。 空气分配系统联接到空气推进器并且可操作以将气流分配到多个电子部件。
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公开(公告)号：US07126821B2
公开(公告)日：2006-10-24
申请号：US10990181
申请日：2004-11-16
IPC分类号： H05K7/20
CPC分类号： H05K7/20172
摘要： The present invention provides a ventilated casing for an electronic device. The ventilated casing includes a housing which has a ventilation inlet and a ventilation outlet. The ventilated casing also includes a high speed fan for moving air from the ventilation inlet to the ventilation outlet to dissipate heat that in use is generated by electronic components positioned in the housing. The fan has a blade, a motor and an air guiding portion positioned near the blade. The air guiding portion has a first mode resonance frequency that is greater than the rotational frequency of the fan.
摘要翻译： 本发明提供一种用于电子设备的通风外壳。 通风外壳包括具有通风口和通风口的外壳。 通风外壳还包括用于将空气从通风入口移动到通风出口的高速风扇，以散发在使用中由位于壳体中的电子部件产生的热量。 风扇具有叶片，马达和位于叶片附近的空气引导部分。 空气引导部分具有大于风扇旋转频率的第一模式共振频率。
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公开(公告)号：US20060104029A1
公开(公告)日：2006-05-18
申请号：US10989924
申请日：2004-11-16
申请人： Chandrakant Patel , Wade Vinson , Rich Bargerhuff
发明人： Chandrakant Patel , Wade Vinson , Rich Bargerhuff
IPC分类号： H05K7/20
CPC分类号： H05K7/20172
摘要： The present invention provides a ventilated casing for an electronic device. The ventilated casing includes a housing which has a ventilation inlet and a ventilation outlet. The ventilated casing also includes a high speed fan for moving air from the ventilation inlet to the ventilation outlet to dissipate heat that in use is generated by electronic components positioned in the housing. The fan has a blade, a motor and an air guiding portion positioned near the blade. The ventilated casing further includes a damping material for damping a noise originating from a vibration generated by the fan.
摘要翻译： 本发明提供一种用于电子设备的通风外壳。 通风外壳包括具有通风口和通风口的外壳。 通风外壳还包括用于将空气从通风入口移动到通风出口的高速风扇，以散发在使用中由位于壳体中的电子部件产生的热量。 风扇具有叶片，马达和位于叶片附近的空气引导部分。 通风外壳还包括用于阻尼源自风扇产生的振动的噪声的阻尼材料。
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公开(公告)号：US20060104027A1
公开(公告)日：2006-05-18
申请号：US10989922
申请日：2004-11-16
申请人： Wade Vinson , Egons Dunens , Rich Bargerhuff
发明人： Wade Vinson , Egons Dunens , Rich Bargerhuff
IPC分类号： H05K7/20
CPC分类号： H05K7/20136 , G06F1/20
摘要： The present invention relates to a housing assembly for computer hardware and includes side wall panels that define an outer casing that has an air inlet and outlet. The housing assembly also includes a fan and operation of the fan causes streams of air to enter and exit from the inlet and outlet and air to be conveyed within the outer casing to which heat from the computer hardware can be transferred. The housing assembly also includes a noise reduction assembly that includes a tortuous passageway through which air passing through the inlet and/or outlet passes. The tortuous passageway is configured such that sound that is emitted from the fan and enters into the tortuous passageway is dissipated therein so as to minimize the level of sound emanating from the passageway.
摘要翻译： 本发明涉及一种用于计算机硬件的壳体组件，并且包括限定具有空气入口和出口的外壳的侧壁面板。 壳体组件还包括风扇，并且风扇的操作使得空气流进入和排出外部壳体内要被输送的入口和出口以及来自计算机硬件的热量的空气。 壳体组件还包括降噪组件，其包括通过入口和/或出口的空气通过的曲折通道。 曲折通道被配置成使得从风扇发出并进入曲折通道的声音在其中消散，以便使从通道发出的声音的水平最小化。
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公开(公告)号：US07286349B2
公开(公告)日：2007-10-23
申请号：US10989924
申请日：2004-11-16
IPC分类号： H05K7/20
CPC分类号： H05K7/20172
摘要： The present invention provides a ventilated casing for an electronic device. The ventilated casing includes a housing which has a ventilation inlet and a ventilation outlet. The ventilated casing also includes a high speed fan for moving air from the ventilation inlet to the ventilation outlet to dissipate heat that in use is generated by electronic components positioned in the housing. The fan has a blade, a motor and an air guiding portion positioned near the blade. The ventilated casing further includes a damping material for damping a noise originating from a vibration generated by the fan.
摘要翻译： 本发明提供一种用于电子设备的通风外壳。 通风外壳包括具有通风口和通风口的外壳。 通风外壳还包括用于将空气从通风入口移动到通风出口的高速风扇，以散发在使用中由位于壳体中的电子部件产生的热量。 风扇具有叶片，马达和位于叶片附近的空气引导部分。 通风外壳还包括用于阻尼源自风扇产生的振动的噪声的阻尼材料。
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公开(公告)号：US07286348B2
公开(公告)日：2007-10-23
申请号：US10989922
申请日：2004-11-16
申请人： Wade D. Vinson , Egons Dunens , Rich Bargerhuff
发明人： Wade D. Vinson , Egons Dunens , Rich Bargerhuff
IPC分类号： H05K7/20
CPC分类号： H05K7/20136 , G06F1/20
摘要： The present invention relates to a housing assembly for computer hardware and includes side wall panels that define an outer casing that has an air inlet and outlet. The housing assembly also includes a fan and operation of the fan causes streams of air to enter and exit from the inlet and outlet and air to be conveyed within the outer casing to which heat from the computer hardware can be transferred. The housing assembly also includes a noise reduction assembly that includes a tortuous passageway through which air passing through the inlet and/or outlet passes. The tortuous passageway is configured such that sound that is emitted from the fan and enters into the tortuous passageway is dissipated therein so as to minimize the level of sound emanating from the passageway.
摘要翻译： 本发明涉及一种用于计算机硬件的壳体组件，并且包括限定具有空气入口和出口的外壳的侧壁面板。 壳体组件还包括风扇，并且风扇的操作使得空气流进入和排出外部壳体内要被输送的入口和出口以及来自计算机硬件的热量的空气。 壳体组件还包括降噪组件，其包括通过入口和/或出口的空气通过的曲折通道。 曲折通道被配置成使得从风扇发出并进入曲折通道的声音在其中消散，以便使从通道发出的声音的水平最小化。
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公开(公告)号：US07248472B2
公开(公告)日：2007-07-24
申请号：US11131710
申请日：2005-05-18
申请人： Wade D. Vinson , Jeffery M. Giardina , Joseph R. Allen , Christopher G. Malone , Chandrakant Patel , David M. Paquin , Rich Bargerhuff
发明人： Wade D. Vinson , Jeffery M. Giardina , Joseph R. Allen , Christopher G. Malone , Chandrakant Patel , David M. Paquin , Rich Bargerhuff
IPC分类号： H05K7/20
CPC分类号： H05K7/20727 , G06F1/20
摘要： A computer system comprising a plurality of electronic components disposed within a chassis. The electronic components generate a cooling load of at least 50 CFM at 2 inches of water or greater. An air mover is disposed within said chassis and is operable to generate airflow of at least 50 CFM at 2 inches of water or greater. An air distribution system is coupled to the air mover and is operable to distribute the airflow to the plurality of electronic components.
摘要翻译： 一种包括设置在底盘内的多个电子部件的计算机系统。 电子部件在2英寸水或更大的温度下产生至少50CFM的冷却负荷。 空气移动器设置在所述底盘内，并且可操作以产生至少50CFM的气流，2英寸水或更大。 空气分配系统联接到空气推进器并且可操作以将气流分配到多个电子部件。
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公开(公告)号：US20060104030A1
公开(公告)日：2006-05-18
申请号：US10990181
申请日：2004-11-16
申请人： Chandrakant Patel , Wade Vinson , Rich Bargerhuff
发明人： Chandrakant Patel , Wade Vinson , Rich Bargerhuff
IPC分类号： H05K7/20
CPC分类号： H05K7/20172
摘要： The present invention provides a ventilated casing for an electronic device. The ventilated casing includes a housing which has a ventilation inlet and a ventilation outlet. The ventilated casing also includes a high speed fan for moving air from the ventilation inlet to the ventilation outlet to dissipate heat that in use is generated by electronic components positioned in the housing. The fan has a blade, a motor and an air guiding portion positioned near the blade. The air guiding portion has a first mode resonance frequency that is greater than the rotational frequency of the fan.
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公开(公告)号：US20060104028A1
公开(公告)日：2006-05-18
申请号：US10989923
申请日：2004-11-16
申请人： Chandrakant Patel , Wade Vinson , Rich Bargerhuff
发明人： Chandrakant Patel , Wade Vinson , Rich Bargerhuff
IPC分类号： H05K7/20
CPC分类号： H05K7/20172
摘要： The present invention provides a ventilated casing for an electronic device. The ventilated casing includes a housing which has a ventilation inlet and a ventilation outlet. The ventilated casing also includes a high speed fan for moving air from the ventilation inlet to the ventilation outlet to dissipate heat that in use is generated by electronic components positioned in the housing. The fan has a blade, a motor and an air guiding portion positioned near the blade. The ventilated casing further includes a suspension for suspending the fan relative to the housing and for damping transmission of vibration originating from the fan.
摘要翻译： 本发明提供一种用于电子设备的通风外壳。 通风外壳包括具有通风口和通风口的外壳。 通风外壳还包括用于将空气从通风入口移动到通风出口的高速风扇，以散发在使用中由位于壳体中的电子部件产生的热量。 风扇具有叶片，马达和位于叶片附近的空气引导部分。 通风外壳还包括用于使风扇相对于壳体悬挂并用于阻止来自风扇的振动的传递的悬架。
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