公开(公告)号：US20090040732A1

公开(公告)日：2009-02-12

申请号：US11834652

申请日：2007-08-06

Applicant: Ro-Bin Yang ,  Yi-Hong Shen

Inventor： Ro-Bin Yang ,  Yi-Hong Shen

IPC: H05K7/20

CPC classification number: H05K1/0206 ,  H05K2201/0305 ,  H05K2201/09854 ,  H05K2201/10689

Abstract: A printed circuit board structure for heat dissipation of an integrated circuit includes a printed circuit board having an opening, and a thermal conductive material disposed within the opening, wherein the integrated circuit is disposed over the opening and the thermal conductive material is thermally connected to the integrated circuit. The opening can be designed to have a specific shape to allow the opening to be completely filled by the thermal conductive material during a fillet process, therefore obtaining better heat dissipation performance and protecting the integrated circuit from over heating.

Abstract translation: 集成电路散热的印刷电路板结构包括具有开口的印刷电路板和设置在开口内的导热材料，其中集成电路设置在开口上方，导热材料热连接到 集成电路。 开口可以设计成具有特定的形状，以允许在圆角过程期间由导热材料完全填充开口，从而获得更好的散热性能并保护集成电路免于过热。