公开(公告)号：US06804116B2

公开(公告)日：2004-10-12

申请号：US10323870

申请日：2002-12-18

申请人： Mark J. Owens ,  Chia Seiler ,  Brian Robert Brown ,  Mark Henry Bonwick ,  Quentin Scott ,  Robert Goh ,  Ross Halgren

发明人： Mark J. Owens ,  Chia Seiler ,  Brian Robert Brown ,  Mark Henry Bonwick ,  Quentin Scott ,  Robert Goh ,  Ross Halgren

IPC分类号： H05K720

CPC分类号： H04J14/02 ,  G02B6/293 ,  G02B6/29383 ,  G02B6/29398 ,  G02B6/4452 ,  H04J14/0201

摘要： A chassis member for carrying at least one circuit board for use in a WDM add/drop multiplexer unit, wherein the chassis member is adapted, in use, to function as a heatsink for a heat generating component mounted on the circuit board.

摘要翻译： 一种用于承载用于WDM分插多路复用器单元中的至少一个电路板的底盘部件，其中底盘部件在使用中适于用作安装在电路板上的发热部件的散热器。

公开(公告)号：US06795316B2

公开(公告)日：2004-09-21

申请号：US10028745

申请日：2001-12-21

申请人： Mark J. Owens ,  Chia Seiler ,  Brian Robert Brown ,  Mark Henry Bonwick ,  Quentin Scott ,  Robert Goh ,  Ross Halgren

发明人： Mark J. Owens ,  Chia Seiler ,  Brian Robert Brown ,  Mark Henry Bonwick ,  Quentin Scott ,  Robert Goh ,  Ross Halgren

IPC分类号： H05K720

CPC分类号： H05K7/20809 ,  H04J14/0212

摘要： A casing member for a WDM add/drop multiplexer unit, the casing member comprising a backplane for interconnection of components of the WDM add/drop multiplexer unit inserted in the casing member, and at least one heat sink opening formed in a wall of the casing member disposed to, in use, receive a heat sink structure of a component of the WDM add/drop multiplexer unit in a manner such that the heat sink structure is exposed to an ambient around the casing member when the component is mounted in the casing member, for maintaining a controlled temperature environment inside of the component.

摘要翻译： 一种用于WDM分插多路复用器单元的外壳构件，所述外壳构件包括用于互连插入到所述外壳构件中的WDM分插多路复用器单元的组件的背板以及形成在所述壳体的壁中的至少一个散热开口 在使用中，所述构件被设置成以使得当所述部件安装在所述壳体构件中时所述散热器结构暴露于所述壳体构件周围的环境的方式接收所述WDM分插多路复用器单元的部件的散热器结构 ，用于在组件内部保持受控的温度环境。

公开(公告)号：US06822860B2

公开(公告)日：2004-11-23

申请号：US10323871

申请日：2002-12-18

申请人： Mark J. Owens ,  Chia Seiler ,  Brian Robert Brown ,  Mark Henry Bonwick ,  Quentin Scott ,  Robert Goh ,  Ross Halgren

发明人： Mark J. Owens ,  Chia Seiler ,  Brian Robert Brown ,  Mark Henry Bonwick ,  Quentin Scott ,  Robert Goh ,  Ross Halgren

IPC分类号： H05K720

CPC分类号： H04J14/02 ,  G02B6/293 ,  G02B6/29383 ,  G02B6/29398 ,  G02B6/4452 ,  H04J14/0201

摘要： A casing member for a WDM add/drop multiplexer unit, the casing member comprising a backplane for interconnection of components of the WDM add/drop multiplexer unit inserted in the casing member, and at least one heat sink opening formed in a wall of the casing member disposed to, in use, receive a heat sink structure of a component of the WDM add/drop multiplexer unit in a manner such that the heat sink structure is exposed to an ambient around the casing member when the component is mounted in the casing member, for facilitating maintaining a controlled temperature environment inside of the component.

摘要翻译： 一种用于WDM分插多路复用器单元的外壳构件，所述外壳构件包括用于互连插入到所述外壳构件中的WDM分插多路复用器单元的组件的背板以及形成在所述壳体的壁中的至少一个散热开口 在使用中，所述构件被设置成以使得当所述部件安装在所述壳体构件中时所述散热器结构暴露于所述壳体构件周围的环境的方式接收所述WDM分插多路复用器单元的部件的散热器结构 ，以便于在组件内维持受控的温度环境。