公开(公告)号：US5597034A

公开(公告)日：1997-01-28

申请号：US270193

申请日：1994-07-01

申请人： Charles R. Barker, III ,  Richard E. Olson ,  Stephen E. Lindquist ,  Massimo Hartsarich ,  David A. Cease ,  Robert S. Sobolewski

发明人： Charles R. Barker, III ,  Richard E. Olson ,  Stephen E. Lindquist ,  Massimo Hartsarich ,  David A. Cease ,  Robert S. Sobolewski

IPC分类号： H01L23/467 ,  F28F7/00

CPC分类号： H01L23/467 ,  H01L2924/0002

摘要： A fan heatsink assembly is provided to afford cooling for electronic components mounted on a circuit board. The assembly includes a blower mounted on top of a specially shaped heatsink, the heatsink having a truncated hyperbolic shaped central member, with fins radially emanating from the center. The blower draws air in through the area between the fins, up the curved central portion and into the blower assembly where it is then exited out the sides of the fan. The fins may be smooth or textured, straight or curved. The fan heatsink assembly is attached to the device to be cooled. Heat is transferred from the electronic component, into the heat dissipating member where the fan causes air to be drawn up between the fins and along the curved center portion, removing heat from the heat dissipating member and the electronic component.

摘要翻译： 提供风扇散热器组件以为安装在电路板上的电子部件提供冷却。 组件包括安装在特殊形状的散热器顶部的鼓风机，散热器具有截头双曲形中心构件，其中心从中心径向散发。 鼓风机将空气吸入翅片之间的区域，向上弯曲的中心部分并进入鼓风机组件，然后从风扇的侧面排出。 翅片可以是光滑的或纹理的，直的或弯曲的。 风扇散热器组件连接到要冷却的设备。 热量从电子部件转移到散热构件中，在该散热构件中，风扇使得空气在翅片之间并沿着弯曲的中心部分被拉伸，从散热构件和电子部件移除热量。