公开(公告)号：US20080308213A1

公开(公告)日：2008-12-18

申请号：US11763013

申请日：2007-06-14

Applicant: Thomas J. Hagman ,  Ralph D. Cope ,  Ross Hutter ,  Steven A. Cope ,  Kim Ferrara ,  Nanette M. Gopez ,  Michael J. Case

Inventor： Thomas J. Hagman ,  Ralph D. Cope ,  Ross Hutter ,  Steven A. Cope ,  Kim Ferrara ,  Nanette M. Gopez ,  Michael J. Case

IPC: B65H69/06 ,  B26D7/06 ,  B65H69/02

CPC classification number: B65H39/16 ,  B65H19/1852 ,  B65H2701/1864 ,  Y10T83/2092 ,  Y10T83/2209 ,  Y10T156/12

Abstract: An apparatus for splicing an elongate multi-layered workpiece includes: (a) drives and guides cooperating to drive the workpiece along a working path; (b) a cutter for severing the workpiece; (c) a layer manipulator for separating layers; (d) an applicator for applying adhesive; and (e) a deflector unit for deflecting the workpiece from the working path. The cutter effects the severing to present first and second workpiece segments. The layer manipulator effects inter-layer separation in one segment to present an interlayer zone in the one segment. A drive inserts the other segment in the interlayer zone. The layer manipulator urges the layers together to capture the other segment within the interlayer zone to establish a multi-layer structure. A drive and at least one of the workpiece deflector unit and the applicator situate the multi-layer structure adjacent to the applicator for finishing the splicing by applying adhesive to the multi-layer structure.

Abstract translation: 一种用于拼接细长多层工件的装置包括：（a）协同驱动和驱动工件沿着工作路径的驱动和导向; （b）用于切割工件的切割器; （c）用于分离层的层操纵器; （d）用于施加粘合剂的施加器; 和（e）用于使工件从工作路径偏转的偏转器单元。 切割器影响切割以呈现第一和第二工件段。 层操纵器在一个段中实现层间分离，以在一个段中呈现中间层区。 驱动器将另一个段插入中间区域。 层操纵器将层叠在一起以捕获夹层区内的另一段以建立多层结构。 驱动器和工件偏转器单元和施加器中的至少一个位于与施加器相邻的多层结构，以通过将粘合剂施加到多层结构来完成拼接。

公开(公告)号：US07803242B2

公开(公告)日：2010-09-28

申请号：US11763013

申请日：2007-06-14

Applicant: Thomas J. Hagman ,  Ralph D. Cope ,  Ross Hutter ,  Steven A. Cope ,  Kim Ferrara ,  Nanette M. Gopez ,  Michael J. Case

Inventor： Thomas J. Hagman ,  Ralph D. Cope ,  Ross Hutter ,  Steven A. Cope ,  Kim Ferrara ,  Nanette M. Gopez ,  Michael J. Case

IPC: B65H69/06 ,  B65H69/02 ,  B26D7/06

CPC classification number: B65H39/16 ,  B65H19/1852 ,  B65H2701/1864 ,  Y10T83/2092 ,  Y10T83/2209 ,  Y10T156/12

Abstract: An apparatus for splicing an elongate multi-layered workpiece includes: (a) drives and guides cooperating to drive the workpiece along a working path; (b) a cutter for severing the workpiece; (c) a layer manipulator for separating layers; (d) an applicator for applying adhesive; and (e) a deflector unit for deflecting the workpiece from the working path. The cutter effects the severing to present first and second workpiece segments. The layer manipulator effects inter-layer separation in one segment to present an interlayer zone in the one segment. A drive inserts the other segment in the interlayer zone. The layer manipulator urges the layers together to capture the other segment within the interlayer zone to establish a multi-layer structure. A drive and at least one of the workpiece deflector unit and the applicator situate the multi-layer structure adjacent to the applicator for finishing the splicing by applying adhesive to the multi-layer structure.

Abstract translation: 一种用于拼接细长多层工件的装置包括：（a）协同驱动和驱动工件沿着工作路径的驱动和导向; （b）用于切割工件的切割器; （c）用于分离层的层操纵器; （d）用于施加粘合剂的施加器; 和（e）用于使工件从工作路径偏转的偏转器单元。 切割器影响切割以呈现第一和第二工件段。 层操纵器在一个段中实现层间分离，以在一个段中呈现中间层区。 驱动器将另一个段插入中间区域。 层操纵器将层叠在一起以捕获夹层区内的另一段以建立多层结构。 驱动器和工件偏转器单元和施加器中的至少一个位于与施加器相邻的多层结构，以通过将粘合剂施加到多层结构来完成拼接。