公开(公告)号：US20230034146A1

公开(公告)日：2023-02-02

申请号：US17725374

申请日：2022-04-20

申请人： Rudi Locher ,  SUNSTAR SUISSE S.A.

发明人： Jürgen Butz ,  Rudi Locher

IPC分类号： B29C45/16 ,  A46D3/00 ,  B29C45/26 ,  A61C15/00

摘要： An index plate molding device configured to produce a multi-component part including an injection mold having an injection parting surface, and an ejection mold having an ejection parting surface in selective contact with the injection parting surface to form an ejection parting line therebetween. The index plate molding device also includes an index plate movable relative to the injection mold and the ejection mold, where the index plate includes an index parting surface in selective contact with the injection parting surface to form an index parting line therebetween, and where the index plate is shaped such that the outer surface of the first component of the multi-component part is available for overmolding on both sides of the index parting line when the first component is coupled to the index plate.

公开(公告)号：US20180290358A1

公开(公告)日：2018-10-11

申请号：US15946535

申请日：2018-04-05

申请人： Rudi Locher ,  SUNSTAR SUISSE S.A.

发明人： Jürgen Butz ,  Rudi Locher

IPC分类号： B29C45/16

摘要： An index plate molding device configured to produce a multi-component part including an injection mold having an injection parting surface, and an ejection mold having an ejection parting surface in selective contact with the injection parting surface to form an ejection parting line therebetween. The index plate molding device also includes an index plate movable relative to the injection mold and the ejection mold, where the index plate includes an index parting surface in selective contact with the injection parting surface to form an index parting line therebetween, and where the index plate is shaped such that the outer surface of the first component of the multi-component part is available for overmolding on both sides of the index parting line when the first component is coupled to the index plate.