公开(公告)号：US20200263281A1

公开(公告)日：2020-08-20

申请号：US16786845

申请日：2020-02-10

申请人： Alexander Plotkowski ,  Ryan Dehoff ,  Frederick List, III ,  Jason Pries ,  Benjamin Stump ,  Keith Carver ,  Peeyush Nandwana

发明人： Alexander Plotkowski ,  Ryan Dehoff ,  Frederick List, III ,  Jason Pries ,  Benjamin Stump ,  Keith Carver ,  Peeyush Nandwana

IPC分类号： C22C38/02 ,  B33Y10/00 ,  B33Y70/00 ,  B33Y80/00 ,  C22C38/00 ,  B23K26/34 ,  B23K26/354

摘要： Disclosed herein are embodiments of soft magnetic alloy embodiments for use in additive manufacturing and structures fabricated from such alloys. In some embodiments, the fabricated structures comprise a continuous thin wall (or plurality thereof) having a geometry that promotes reduced eddy current losses and other performance enhancements. In some embodiments, the fabricated structures are used to make components, such as transformer cores and/or electric motors.

公开(公告)号：US20210214823A1

公开(公告)日：2021-07-15

申请号：US16894551

申请日：2020-06-05

申请人： Lawrence Allard, JR. ,  Sumit Bahl ,  Ryan Dehoff ,  Hunter Henderson ,  Michael Kesler ,  Scott McCall ,  Peeyush Nandwana ,  Ryan Ott ,  Alex Plotkowski ,  Orlando Rios ,  Amit Shyam ,  Zachary Sims ,  Kevin Sisco ,  David Weiss ,  Ying Yang

发明人： Lawrence Allard, JR. ,  Sumit Bahl ,  Ryan Dehoff ,  Hunter Henderson ,  Michael Kesler ,  Scott McCall ,  Peeyush Nandwana ,  Ryan Ott ,  Alex Plotkowski ,  Orlando Rios ,  Amit Shyam ,  Zachary Sims ,  Kevin Sisco ,  David Weiss ,  Ying Yang

IPC分类号： C22C21/00 ,  B22F3/105 ,  B33Y70/00

摘要： Disclosed herein are embodiments of an Al—Ce—Mn alloy for use in additive manufacturing. The disclosed alloy embodiments provide fabricated objects, such as bulk components, comprising a heterogeneous microstructure and having good mechanical properties even when exposed to conditions used during the additive manufacturing process. Methods for making and using alloy embodiments also are disclosed herein.