公开(公告)号：US5929997A

公开(公告)日：1999-07-27

申请号：US887245

申请日：1997-07-02

Applicant: S. Benjamin Lin

Inventor： S. Benjamin Lin

IPC: G03F9/00 ,  G01B11/00

CPC classification number: G03F9/7084

Abstract: The present invention discloses a method for aligning a reticle with a semiconductor wafer. The method includes the steps of (a) applying a light source and an optical system for directing an incident light beam to a plurality of reticle alignment marks on the reticle to project a reticle-mark beam to an alignment detector therefrom; (b) applying the light source and the optical system for directing the incident light beam to a plurality of wafer alignment marks on a second surface of the wafer for projecting a wafer-mark beam therefrom wherein the second surface opposite a first surface of the wafer facing the reticle; and (c)applying the optical system for directing the wafer-mark beam to the alignment detector for precisely aligning the reticle and the wafer.

Abstract translation: 本发明公开了一种用于将掩模版与半导体晶片对准的方法。 该方法包括以下步骤：（a）应用光源和光学系统，用于将入射光束引导到光罩上的多个标线对准标记，以将标线光标投射到对准检测器; （b）施加光源和光学系统，用于将入射光束引导到晶片的第二表面上的多个晶片对准标记，用于从其中投射晶片标记光束，其中与晶片的第一表面相对的第二表面 面对光罩; 和（c）应用光学系统将晶片标记光束引导到对准检测器，以精确对准标线片和晶片。