MULTILAYER ELECTRONIC COMPONENT
    1.
    发明申请

    公开(公告)号:US20250166912A1

    公开(公告)日:2025-05-22

    申请号:US18894678

    申请日:2024-09-24

    Abstract: A multilayer electronic component includes a body including a dielectric layer and an internal electrode alternately disposed with the dielectric layer; an interfacial plating layer disposed at an end of the internal electrode and including one or more B and P and Ni; and an external electrode disposed to cover the interfacial plating layer and including an electrode layer including glass containing Si and Al and a conductive metal, wherein the electrode layer includes an inner region adjacent to the interfacial plating layer and an outer region disposed on the inner region, and an area fraction of the glass included in the inner region may be higher than an area fraction of the glass included in the outer region.

    MULTILAYER ELECTRONIC COMPONENT
    2.
    发明申请

    公开(公告)号:US20250166911A1

    公开(公告)日:2025-05-22

    申请号:US18942724

    申请日:2024-11-10

    Abstract: A multilayer electronic component may include: a body including dielectric layers and having first and second surfaces opposing each other in a first direction, third and fourth surfaces opposing each other, and fifth and sixth surfaces opposing each other; first and second side margin portions disposed on the fifth and sixth surfaces, respectively; and first and second external electrodes disposed on the third and fourth surfaces, respectively. The body may include an active portion including an internal electrode alternately disposed with the dielectric layer, upper and lower cover portions disposed above and below the active portion in the first direction, respectively. One of the first and second side margin portions may include an inner margin portion covering at least a portion of the active portion, and an outer margin portion disposed on the inner margin portion and being in contact with the upper and lower cover portions.

    MULTILAYER ELECTRONIC COMPONENT
    3.
    发明申请

    公开(公告)号:US20250166910A1

    公开(公告)日:2025-05-22

    申请号:US18910777

    申请日:2024-10-09

    Abstract: A multilayer electronic component includes a body including a dielectric layer and an internal electrode; and an external electrode disposed on the body, wherein the dielectric layer includes a main component represented by (Cax, Sr1-x)(Zry, Ti1-y)O3, and includes a first sub-component including rare earth elements including at least one of yttrium (Y), dysprosium (Dy), or terbium (Tb), a second sub-component including silicon (Si), and a third sub-component including variable valence acceptor elements, and wherein a content of rare earth elements of the first sub-component is 1.0 moles or higher and 2.0 moles or lower based on 100 moles of the main component.

    MULTILAYER ELECTRONIC COMPONENT
    4.
    发明申请

    公开(公告)号:US20250166908A1

    公开(公告)日:2025-05-22

    申请号:US18918978

    申请日:2024-10-17

    Abstract: A multilayer electronic component includes a body including a dielectric layer and an internal electrode; and an external electrode disposed on the body, wherein the dielectric layer includes acceptor elements including vanadium (V), donor elements including rare earth elements, and titanium (Ti), and wherein, when the number of moles of the acceptor elements per 100 moles of titanium (Ti) is defined as Am, the number of moles of the donor elements per 100 moles of titanium (Ti) is defined as Dm, and the number of moles of vanadium (V) based on per of titanium (Ti) is defined as Vm, 1.2≤Dm/Am≤1.4 and 0.2≤Vm/Dm is satisfied.

    MULTILAYERED CAPACITOR
    5.
    发明申请

    公开(公告)号:US20250166905A1

    公开(公告)日:2025-05-22

    申请号:US18605026

    申请日:2024-03-14

    Abstract: Provided is a multilayered capacitor, including a capacitor body including a dielectric layer and an internal electrode, and an external electrode disposed outside the capacitor body, wherein the dielectric layer includes a plurality of dielectric grains containing barium titanate as a primary component, at least one of the plurality of dielectric grains has a core-shell structure, the average mole ratio of barium to titanium (Ba/Ti mole ratio) in the core of the dielectric grain is 0.9975 to 1.0055, and the average number of cores per unit area (1 μm×1 μm) in the dielectric layer is 25 to 35.

    COIL COMPONENT
    6.
    发明申请

    公开(公告)号:US20250166877A1

    公开(公告)日:2025-05-22

    申请号:US18912800

    申请日:2024-10-11

    Abstract: A coil component includes a body including an intermediate layer, and having a first surface and a second surface opposing each other, and a plurality of side surfaces connecting the first surface to the second surface; a first coil disposed in the body and including a first coil pattern having at least one turn; a second coil spaced apart from the first coil in the body and including a second coil pattern having at least one turn; first and second external electrodes disposed on the body and connected to the first coil; and third and fourth external electrodes disposed on the body and connected to the second coil, wherein the intermediate layer has permeability lower than permeability of the other region of the body, is disposed between the first coil and the second coil, and is spaced apart from each of the first coil and the second coil.

    OPTICAL SYSTEM
    7.
    发明申请

    公开(公告)号:US20250164753A1

    公开(公告)日:2025-05-22

    申请号:US19028735

    申请日:2025-01-17

    Inventor: Yong Joo JO

    Abstract: An optical system includes: a first lens having refractive power; a second lens having refractive power; a third lens having refractive power and comprising an image-side surface which is convex in a paraxial region; a fourth lens having refractive power; a fifth lens having refractive power and comprising an image-side surface which is concave in the paraxial region; a sixth lens having refractive power; and a stop disposed in front of an object-side surface of the first lens. The first to sixth lenses are sequentially disposed from an object side. A radius of the stop SD and an overall focal length of the optical system f satisfy: 0.2

    PRINTED CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF

    公开(公告)号:US20250159806A1

    公开(公告)日:2025-05-15

    申请号:US18782242

    申请日:2024-07-24

    Inventor: Yongjin Oh

    Abstract: A printed circuit board according to an embodiment may include an insulating layer; a wiring layer buried in the insulating layer; and a pad portion protruding from the insulating layer in a height direction, in which the pad portion may include a first portion and a second portion disposed below the first portion in the height direction, a width of the second portion may be greater than that of the first portion of the pad portion in a plane direction perpendicular to the height direction, a side wall of the second portion may have a curved shape in the height direction, and the side wall of the second portion may be buried in the insulating layer.

    OPTICAL SYSTEM
    9.
    发明申请

    公开(公告)号:US20250155686A1

    公开(公告)日:2025-05-15

    申请号:US19028207

    申请日:2025-01-17

    Inventor: Ju Hwa SON

    Abstract: An optical system includes a first lens having negative refractive power and having two concave surfaces, a second lens having positive refractive power, a third lens having refractive power, a fourth lens having refractive power, a fifth lens having refractive power, a sixth lens having refractive power, and a seventh lens having refractive power. The first to seventh lenses are sequentially disposed from an object side.

    IMAGING LENS SYSTEM
    10.
    发明申请

    公开(公告)号:US20250155674A1

    公开(公告)日:2025-05-15

    申请号:US18815963

    申请日:2024-08-27

    Abstract: An imaging lens system is provided. The imaging lens system includes a first lens group including one or more lenses, and a second lens group including one or more lenses and configured to be movable in an optical axis direction. The first lens group and the second lens group are sequentially arranged from an object side toward an imaging plane. The imaging lens system satisfies the conditional expression TTL/(ImgHT*2)

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