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公开(公告)号：US20250166918A1
公开(公告)日：2025-05-22
申请号：US18949088
申请日：2024-11-15
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor： Hyung Jong CHOI , Chung Eun LEE , Yong Min KIM , Kwan Hee YUN , Seon Ho KIM
Abstract: A multilayer electronic component includes a first external electrode including a first connection portion disposed on a third surface of a body, and a first band portion extending from the first connection portion onto a portion of a first surface of the body and a portion of a second surface of the body, wherein the first external electrode includes a first electrode layer connected to the first internal electrode, and a first conductive resin layer disposed on the first electrode layer in the first band portion and including a second conductive metal and a thermosetting resin, the first electrode layer includes a first conductive metal and glass, and the first conductive resin layer is not disposed on the first connection portion.
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Patent Agency Ranking
公开(公告)号：US20230207185A1
公开(公告)日：2023-06-29
申请号：US18076715
申请日：2022-12-07
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor： Yong Min KIM , Jae Hun KIM , Chang Yun LEE , Dae Chul CHOI , Se Yeon HWANG , Yeo Ok JEON
CPC classification number: H01F27/292 , H01F27/2828 , H01F17/045 , H01F27/2804
Abstract: A coil component includes a body having a first surface, a coil including a coil pattern having a plurality of turns, a first and second lead-out portions disposed in the body and connected to one end and the other end of the coil, respectively, a first and second dummy lead-out portions disposed in the body and spaced apart from the coil, a first and second external electrodes disposed on the first surface of the body and connected to the first and second lead-out portions, respectively. A coil pattern closest to the first surface among the coil patterns disposed in a region between the first lead-out portion and the first dummy lead-out portion is connected to the first lead-out portion.
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公开(公告)号：US20210398738A1
公开(公告)日：2021-12-23
申请号：US17222537
申请日：2021-04-05
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor： Yong Min KIM , Jae Hun KIM , Ji Hyuk LIM , Jong Yun KIM
Abstract: A coil component includes a body having one surface and the other surface, opposing each other, and both end surfaces, opposing each other, a support substrate disposed inside the body, and including a core portion, and a support portion connected to the core portion, a coil portion disposed on the core portion, and a lead portion disposed on the support portion and connected to the coil portion to be exposed to one surface of the body. The support portion is disposed to be more adjacent to the one surface of the body than the core portion.
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公开(公告)号：US20250166914A1
公开(公告)日：2025-05-22
申请号：US18909094
申请日：2024-10-08
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor： Jae Eun HEO , Yong Min KIM , Chung Eun LEE , Sang Hyeon LEE , Hyung Jong CHOI , Chae Won BAK
Abstract: A multilayer electronic component may include: a body including a dielectric layer and internal electrodes, the body having opposing first and second surfaces and opposing third and fourth surfaces; a first external electrode including a first connection portion on the third surface, and a first band portion extending from the first connection portion to the first surface; a second external electrode including a second connection portion on the fourth surface, and a second band portion extending from the second connection portion to the first surface; and an insulating layer disposed on the second surface to extend onto the first and second band portions. The first and second external electrodes may include an electrode layer and a plating layer on the electrode layer, and the insulating layer may be in contact with the electrode layer in the first and second band portions and may cover an end of the electrode layer.
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公开(公告)号：US20140049358A1
公开(公告)日：2014-02-20
申请号：US13716982
申请日：2012-12-17
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor： Yong Min KIM , Jung II KIM , Ichiro TANAKA , Young Tae KIM , Heun Ku KANG
CPC classification number: H01C7/00 , H01C7/003 , H01C17/006 , H01C17/065 , H01C17/06526 , Y10T29/49082
Abstract: There are provided a chip resistor and a method of manufacturing the same. The chip resistor includes a ceramic substrate; an adhesion portion formed on a surface of the ceramic substrate; and a resistor formed on the adhesion portion, wherein the adhesion portion includes at least one of copper (Cu), nickel (Ni), and copper-nickel (Cu—Ni).
Abstract translation: 提供了片式电阻器及其制造方法。 芯片电阻器包括陶瓷基板; 形成在所述陶瓷基板的表面上的粘合部; 和形成在粘接部分上的电阻器，其中粘合部分包括铜（Cu），镍（Ni）和铜 - 镍（Cu-Ni）中的至少一种。
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公开(公告)号：US20250166911A1
公开(公告)日：2025-05-22
申请号：US18942724
申请日：2024-11-10
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor： Jae Eun HEO , Hyung Jong CHOI , Chae Won BAK , Chung Eun LEE , Sang Hyeon LEE , Yong Min KIM
Abstract: A multilayer electronic component may include: a body including dielectric layers and having first and second surfaces opposing each other in a first direction, third and fourth surfaces opposing each other, and fifth and sixth surfaces opposing each other; first and second side margin portions disposed on the fifth and sixth surfaces, respectively; and first and second external electrodes disposed on the third and fourth surfaces, respectively. The body may include an active portion including an internal electrode alternately disposed with the dielectric layer, upper and lower cover portions disposed above and below the active portion in the first direction, respectively. One of the first and second side margin portions may include an inner margin portion covering at least a portion of the active portion, and an outer margin portion disposed on the inner margin portion and being in contact with the upper and lower cover portions.
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