公开(公告)号：US06315643B1

公开(公告)日：2001-11-13

申请号：US09344495

申请日：1999-06-25

申请人： Hirokuni Hiyama ,  Seiyo Maekawa ,  Yutaka Wada

发明人： Hirokuni Hiyama ,  Seiyo Maekawa ,  Yutaka Wada

IPC分类号： B24B100

CPC分类号： B24B37/04 ,  B24B57/02

摘要： A polishing apparatus including a turntable having an upper polishing surface, at least one carrier for carrying an article with a surface to be polished in such a manner that the surface is engaged with the upper polishing surface of the turntable, and at least one slurry supply nozzle provided for the carrier and adapted to supply a slurry on the polishing surface of the turntable at a predetermined slurry supply point upstream of a line connecting the center axes of the turntable and the carrier in the direction of rotation of the turntable while the turntable and the carrier are rotated around their respective center axes with the surface of the article kept in engagement with the polishing surface. The nozzle is preferably positioned such that an angle is formed between the line connecting the center axis of the turntable and the center axis of the carrier and a line connecting the center axis of the carrier and the predetermined slurry supply point is in the range of from 5 degrees to 40 degrees.

摘要翻译： 一种抛光装置，包括具有上抛光表面的转台，至少一个载体，用于承载具有待抛光表面的制品，使得该表面与转台的上抛光表面接合，以及至少一个浆料供应 喷嘴，其设置用于载体，并且适于在转台的旋转方向上连接转台和载体的中心轴线的上游的预定浆料供应点处在转台的抛光表面上提供浆料，同时转盘和 载体围绕其各自的中心轴线旋转，同时制品的表面保持与抛光表面接合。 喷嘴优选地定位成使得在连接转盘的中心轴线和载体的中心轴线的线与连接载体的中心轴线与预定浆料供应点之间形成的角度在从 5度至40度。