公开(公告)号：US07192867B1

公开(公告)日：2007-03-20

申请号：US10184336

申请日：2002-06-26

Applicant: Mira Ben-Tzur ,  Krishnaswamy Ramkumar ,  Seurabh Dutta Chowdhury ,  Michal Efrati Fastow

Inventor： Mira Ben-Tzur ,  Krishnaswamy Ramkumar ,  Seurabh Dutta Chowdhury ,  Michal Efrati Fastow

IPC: H01L21/302

CPC classification number: H01L21/76831 ,  H01L21/76814

Abstract: In one embodiment, a passivation level includes a low-k dielectric. To prevent the low-k dielectric from absorbing moisture when exposed to air, exposed portions of the low-k dielectric are covered with spacers. As can be appreciated, this facilitates integration of low-k dielectrics in passivation levels. Low-k dielectrics in passivation levels help lower capacitance on metal lines, thereby reducing RC delay and increasing signal propagation speeds.

Abstract translation: 在一个实施例中，钝化层包括低k电介质。 为了防止低k电介质暴露于空气时吸收水分，低k电介质的暴露部分被间隔物覆盖。 可以理解，这有助于低k电介质在钝化层中的集成。 钝化层中的低k电介质有助于降低金属线路上的电容，从而减少RC延迟并增加信号传播速度。