公开(公告)号：US20090277614A1

公开(公告)日：2009-11-12

申请号：US12118822

申请日：2008-05-12

申请人： Shih-Yuan LIN ,  Chien-Hsing Wu ,  Chia-Hsun Lin ,  Shen-Huang Hsu

发明人： Shih-Yuan LIN ,  Chien-Hsing Wu ,  Chia-Hsun Lin ,  Shen-Huang Hsu

IPC分类号： F28D15/00

CPC分类号： F28D15/0233 ,  F28D15/0275 ,  F28F3/02 ,  H01L23/427 ,  H01L2924/0002 ,  H01L2924/00

摘要： The heat conduction structure includes a first heat conduction plate, a second heat conduction plate and at least one heat pipes. The second heat conduction plate is positioned below the first heat conduction plate. A pair of walls extends from two opposite edges of the second heat conduction plate. The walls connect to a bottom surface of the first heat conduction plate. A receiving space is defined between the first heat conduction plate and the second heat conduction plate. At least one heat pipe is arranged in the receiving space and sandwiched between the first heat conduction plate and the second heat conduction plate. Each heat pipe has a heat absorbing section and a plurality of heat emitting sections extending from each heat absorbing section. A plurality of heat dissipating passages is defined between the at least one heat pipe and the walls. The heat emitting sections are partially positioned in the heat dissipating passages. The heat conduction structure can combine with a heat dissipating body and a fan to a heat dissipating device.

摘要翻译： 导热结构包括第一导热板，第二导热板和至少一个热管。 第二导热板位于第一导热板的下方。 一对壁从第二导热板的两个相对的边缘延伸。 壁连接到第一导热板的底表面。 在第一导热板和第二导热板之间限定接收空间。 至少一个热管布置在接收空间中并夹在第一导热板和第二导热板之间。 每个热管具有吸热部分和从每个吸热部分延伸的多个发热部分。 在至少一个热管和壁之间限定多个散热通道。 发热部分位于散热通道中。 热传导结构可以与散热体和风扇结合到散热装置。