公开(公告)号：US20230123791A1

公开(公告)日：2023-04-20

申请号：US17969294

申请日：2022-10-19

申请人： Shiloh Judah Spoo ,  Dominik Scheffler ,  Ashraf Wahba

发明人： Shiloh Judah Spoo ,  Dominik Scheffler ,  Ashraf Wahba

IPC分类号： E04G23/02 ,  H05B47/16

摘要： A curing device is positionable to a mount on a resin injector to cure the resin injected into a defect in glass. A housing of the curing device is removably positionable to a mounted position on the resin injector. When in the mounted position the curing device positions a light area from light emitters to an area surrounding the nozzle of the injector to provide curing of the injected resin. A GPS locator can ascertain a location, date, and time of use of the curing device and store such use information in electronic memory.