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公开(公告)号:US07162071B2
公开(公告)日:2007-01-09
申请号:US10326499
申请日:2002-12-20
IPC分类号: G06K9/00
CPC分类号: G06T7/001 , G06T2207/30148
摘要: A progressive self-learning (PSL) method is provided for enhancing wafer or mask defect inspection review and classification by identifying a plurality of wafer or mask defects, and by classifying each of the plurality of defects according to an extent of resemblance of each defect. The method having the steps of: performing image processing on a scanned defect image; aligning the scanned defect image with a just-stored digitized defect image; matching the scanned defect image with a just-stored digitized defect image; and classifying the scanned defect image.
摘要翻译: 提供了一种渐进式自学习(PSL)方法,用于通过识别多个晶片或掩模缺陷以及通过根据每个缺陷的相似程度对每个缺陷进行分类来增强晶片或掩模缺陷检查审查和分类。 该方法具有以下步骤:对扫描的缺陷图像执行图像处理; 将扫描的缺陷图像与刚刚存储的数字化缺陷图像对准; 将扫描的缺陷图像与刚刚存储的数字化缺陷图像进行匹配; 并对扫描的缺陷图像进行分类。