公开(公告)号：US20220344530A1

公开(公告)日：2022-10-27

申请号：US17575019

申请日：2022-01-13

申请人： Raynergy Tek Incorporation ,  Shinera Co., Ltd.

发明人： YI-MING CHANG ,  CHUN-CHIEH LEE ,  JUI-CHIH KAO ,  NAI-WEI TENG

IPC分类号： H01L31/18 ,  H01L31/0392 ,  H01L31/0224

摘要： An electronic device includes a substrate, a plurality of electronic components and a conductive material. The electronic components are arranged on the substrate, and the electronic components respectively include a lower electrode, a semiconductor layer and an upper electrode, and they are sequentially stacked on the substrate. The electronic components share the semiconductor layer, and the semiconductor layer forms a plurality of connecting channels through the semiconductor layer. The connecting channels are located between the upper electrode of the first electronic component in the electronic components and the lower electrode of the second electronic component in the electronic components. These connecting channels are processed by lasers of different powers. The conductive material is arranged in the connecting channel so that the upper electrode of the first electronic component is electrically connected to the lower electrode of the second electronic component.

公开(公告)号：US12094996B2

公开(公告)日：2024-09-17

申请号：US17575019

申请日：2022-01-13

申请人： Raynergy Tek Incorporation ,  Shinera Co., Ltd.

发明人： Yi-Ming Chang ,  Chun-Chieh Lee ,  Jui-Chih Kao ,  Nai-Wei Teng

IPC分类号： H01L31/18 ,  H01L31/0224 ,  H01L31/0392

CPC分类号： H01L31/1804 ,  H01L31/022425 ,  H01L31/0392 ,  H01L31/1852

摘要： An electronic device includes a substrate, a plurality of electronic components and a conductive material. The electronic components are arranged on the substrate, and the electronic components respectively include a lower electrode, a semiconductor layer and an upper electrode, and they are sequentially stacked on the substrate. The electronic components share the semiconductor layer, and the semiconductor layer forms a plurality of connecting channels through the semiconductor layer. The connecting channels are located between the upper electrode of the first electronic component in the electronic components and the lower electrode of the second electronic component in the electronic components. These connecting channels are processed by lasers of different powers. The conductive material is arranged in the connecting channel so that the upper electrode of the first electronic component is electrically connected to the lower electrode of the second electronic component.