公开(公告)号：US06580090B2

公开(公告)日：2003-06-17

申请号：US09887639

申请日：2001-06-22

申请人： Siegfried Johannes Barth ,  Tilman A. Beierlein ,  Siegfried F. Karg ,  Heike Riel ,  Walter Heinrich Riess

发明人： Siegfried Johannes Barth ,  Tilman A. Beierlein ,  Siegfried F. Karg ,  Heike Riel ,  Walter Heinrich Riess

IPC分类号： H01L3524

CPC分类号： H01L51/525 ,  H01L27/3244 ,  H01L51/5212 ,  H01L51/5234 ,  H01L51/5243

摘要： A method of making a light-emitting device comprises forming a first and second components. The first component has a first substrate, a first electrode on the first substrate, an organic layer on the first electrode, and a light-transmissive second electrode on the organic layer. The second component has a light-transmissive second substrate, and a light transmissive, electrically conductive layer on the second substrate. The first and second components are joined with the second electrode of the first component facing the conductive layer of the second component. An electrical contact is formed between the second electrode of the first component and the electrically conductive layer of the second component.

摘要翻译： 制造发光器件的方法包括形成第一和第二组分。 第一部件具有第一基板，第一基板上的第一电极，第一电极上的有机层和有机层上的透光第二电极。 第二部件具有透光的第二基板和在第二基板上的透光的导电层。 第一和第二部件与面向第二部件的导电层的第一部件的第二电极接合。 在第一部件的第二电极和第二部件的导电层之间形成电接触。

公开(公告)号：US06548961B2

公开(公告)日：2003-04-15

申请号：US09887780

申请日：2001-06-22

申请人： Siegfried Johannes Barth ,  Tilman A. Beierlein ,  Siegfried F. Karg ,  Heike Riel ,  Walter Heinrich Riess

发明人： Siegfried Johannes Barth ,  Tilman A. Beierlein ,  Siegfried F. Karg ,  Heike Riel ,  Walter Heinrich Riess

IPC分类号： G09G310

CPC分类号： H01L27/3253

摘要： A method of making a light-emitting device comprises forming a first and second components. The first component has a light-transmissive first substrate, light transmissive first electrode layer on the first substrate, an organic layer on the first electrode, and a second electrode layer on the organic layer. The second component has a second substrate and driver array circuitry on the second substrate. The first component and the second component are joined together with the second electrode of the first component facing the driver array of the second component. An electrical contact is formed between one of the first and second electrode layers of the first component and the driver array circuitry of the second component.