Method for manufacturing a semiconductor device
    1.
    发明授权
    Method for manufacturing a semiconductor device 有权
    半导体器件的制造方法

    公开(公告)号:US08455309B2

    公开(公告)日:2013-06-04

    申请号:US13347361

    申请日:2012-01-10

    IPC分类号: H01L33/08

    CPC分类号: H01L29/66356 H01L29/7391

    摘要: A technology is capable of simplifying a process of manufacturing an asymmetric device in forming a Tunneling Field Effect Transistor (TFET) structure. A method for manufacturing a semiconductor device comprises forming a conductive pattern over a semiconductor substrate, implanting impurity ions with the conductive pattern as a mask to form a first junction region in the semiconductor substrate, forming a first insulating film planarized with the conductive pattern over the first junction region, etching the top of the conductive pattern to expose a sidewall of the first insulating film, forming a spacer at the sidewall of the first insulating film disposed over the conductive pattern, etching the conductive pattern with the spacer as an etching mask to form a gate pattern, and forming a second junction region in the semiconductor substrate with the gate pattern as a mask.

    摘要翻译: 一种技术能够简化在形成隧道场效应晶体管(TFET)结构中制造非对称器件的工艺。 一种制造半导体器件的方法,包括在半导体衬底上形成导电图案,将导电图案作为掩模注入杂质离子,以在半导体衬底中形成第一结区,在导电图案上形成平坦化的第一绝缘膜, 第一接合区域,蚀刻导电图案的顶部以暴露第一绝缘膜的侧壁,在布置在导电图案上的第一绝缘膜的侧壁处形成间隔物,用间隔物蚀刻导电图案作为蚀刻掩模, 形成栅极图案,并且以栅极图案作为掩模在半导体衬底中形成第二结区域。

    METHOD FOR MANUFACTURING A SEMICONDUCTOR DEVICE
    2.
    发明申请
    METHOD FOR MANUFACTURING A SEMICONDUCTOR DEVICE 有权
    制造半导体器件的方法

    公开(公告)号:US20130102114A1

    公开(公告)日:2013-04-25

    申请号:US13347361

    申请日:2012-01-10

    IPC分类号: H01L21/336

    CPC分类号: H01L29/66356 H01L29/7391

    摘要: A technology is capable of simplifying a process of manufacturing an asymmetric device in forming a Tunneling Field Effect Transistor (TFET) structure. A method for manufacturing a semiconductor device comprises forming a conductive pattern over a semiconductor substrate, implanting impurity ions with the conductive pattern as a mask to form a first junction region in the semiconductor substrate, forming a first insulating film planarized with the conductive pattern over the first junction region, etching the top of the conductive pattern to expose a sidewall of the first insulating film, forming a spacer at the sidewall of the first insulating film disposed over the conductive pattern, etching the conductive pattern with the spacer as an etching mask to form a gate pattern, and forming a second junction region in the semiconductor substrate with the gate pattern as a mask.

    摘要翻译: 一种技术能够简化在形成隧道场效应晶体管(TFET)结构中制造非对称器件的工艺。 一种制造半导体器件的方法,包括在半导体衬底上形成导电图案,将导电图案作为掩模注入杂质离子,以在半导体衬底中形成第一结区,在导电图案上形成平坦化的第一绝缘膜, 第一接合区域,蚀刻导电图案的顶部以暴露第一绝缘膜的侧壁,在布置在导电图案上的第一绝缘膜的侧壁处形成间隔物,用间隔物蚀刻导电图案作为蚀刻掩模, 形成栅极图案,并且以栅极图案作为掩模在半导体衬底中形成第二结区域。