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公开(公告)号：US20070225771A1
公开(公告)日：2007-09-27
申请号：US11277213
申请日：2006-03-22
IPC分类号： A61N1/375
CPC分类号： A61N1/3754 , H01R4/02 , H01R4/20 , H01R13/5202 , H01R13/5224
摘要： A feedthrough assembly is disposable in an aperture of, for example, a power source encasement. In various examples, the feedthrough assembly comprises a ferrule, an insulator, a terminal conductor, and a sleeve. A portion of the terminal conductor extends through the ferrule thereby creating a portion internal to and a portion external to the encasement. The insulator is disposed within the ferrule and is sealably engaged with the terminal conductor portion extending through the ferrule. The sleeve is disposed over the internal portion of the terminal conductor and coupled thereto. In one example, the sleeve includes at least one notch on a sleeve first end or a sleeve second end, which may be used to weld or solder the sleeve to the terminal conductor. In another example, the sleeve includes a longitudinally extending void, which may be used to crimp the sleeve to the terminal conductor.
摘要翻译： 馈通组件在例如电源外壳的孔中是一次性的。 在各种示例中，馈通组件包括套圈，绝缘体，端子导体和套筒。 端子导体的一部分延伸穿过套圈，从而在外壳的外部和外部的部分形成一部分。 绝缘体设置在套圈内并且与延伸穿过套圈的端子导体部分密封地接合。 套筒设置在端子导体的内部并与之连接。 在一个示例中，套筒包括套筒第一端或套筒第二端上的至少一个凹口，其可用于将套管焊接或焊接到端子导体。 在另一示例中，套筒包括纵向延伸的空隙，其可以用于将套筒压接到端子导体。
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公开(公告)号：US06879857B2
公开(公告)日：2005-04-12
申请号：US10236628
申请日：2002-09-06
IPC分类号： A61N1/375
CPC分类号： A61N1/3754
摘要： A method of fabricating implantable electronic medical devices eliminates the use of a backfill tube on the header or feed-through by reconfiguring the device's lead connector block anchor so as to provide it with a plug that can be used to seal an aperture in the device's header following removal of undesirable welding gases and replacement with an inert gas with a high breakdown resistance.
摘要翻译： 制造可植入电子医疗装置的方法通过重新配置装置的引导连接器块锚固件来消除在集管或馈通上使用回填管，以便为其提供可用于密封装置的头部中的孔的插头 在除去不期望的焊接气体并用具有高耐击穿性的惰性气体替代之后。
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