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1.
公开(公告)号:US20080023606A1
公开(公告)日:2008-01-31
申请号:US11868571
申请日:2007-10-08
申请人: Robert Kalis , Stephen Waite , Paul Skelton , Dale Langner
发明人: Robert Kalis , Stephen Waite , Paul Skelton , Dale Langner
IPC分类号: A45F5/00
CPC分类号: F16C11/069 , B60R11/0258 , B60R2011/0026 , B60R2011/0056 , B60R2011/0089 , F16C11/0657 , F16M11/14 , F16M13/00 , F16M13/022 , Y10T403/32721 , Y10T403/32737
摘要: Embodiments of the present invention provide a mounting assembly for mounting an electronic device to a surface. The mounting assembly generally includes a base including a mounting ball and a socket assembly operable to frictionally engage the ball to removably couple the socket assembly to the base. The base may be removably coupled with the surface and the socket assembly may be removably coupled with the electronic device. Such a configuration enables the electronic device to be easily positioned in confined environments by first attaching the base to the surface, then attaching the socket assembly to the base and positioning the socket assembly in a desired orientation, and finally attaching the electronic device to the socket assembly.
摘要翻译: 本发明的实施例提供了一种用于将电子设备安装到表面上的安装组件。 安装组件通常包括底座,其包括安装球和可操作以摩擦地接合球的插座组件,以将插座组件可拆卸地连接到底座。 基座可以可移除地与表面耦合,并且插座组件可以可移除地与电子设备耦合。 这样的配置使得电子设备能够通过首先将基座附接到表面来容易地定位在密闭环境中,然后将插座组件附接到基座并将插座组件定位在期望的方向上,并且最后将电子设备附接到插座 部件。
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公开(公告)号:US20070012840A1
公开(公告)日:2007-01-18
申请号:US11304836
申请日:2005-12-15
申请人: Robert Kalis , Stephen Waite
发明人: Robert Kalis , Stephen Waite
IPC分类号: A47F5/00
CPC分类号: F16C11/069 , B60R11/0258 , B60R2011/0026 , B60R2011/0056 , B60R2011/0089 , F16C11/0657 , F16M11/14 , F16M13/00 , F16M13/022 , Y10T403/32721 , Y10T403/32737
摘要: Embodiments of the present invention provide a mounting assembly (100) for mounting an electronic device (D) to a surface (S). The mounting assembly (100) generally includes a base (102) including a mounting ball (110) and a socket assembly (104) operable to frictionally engage the ball (110) to removably couple the socket assembly (104) to the base (102). The base (102) may be removably coupled with the surface (S) and the socket assembly (104) may be removably coupled with the electronic device (D). Such a configuration enables the electronic device (D) to be easily positioned in confined environments by first attaching the base (102) to the surface (S), then attaching the socket assembly (104) to the base (102) and positioning the socket assembly (104) in a desired orientation, and finally attaching the electronic device (D) to the socket assembly (104).
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