Duct for cooling multiple components in a processor-based device
    1.
    发明申请
    Duct for cooling multiple components in a processor-based device 有权
    用于冷却基于处理器的设备中的多个组件的管道

    公开(公告)号:US20060012957A1

    公开(公告)日:2006-01-19

    申请号:US11230711

    申请日:2005-09-20

    IPC分类号: H05K7/20

    摘要: A duct for cooling multiple components in a processor-based device. The duct has an inlet cooling duct section for a cooling airflow focused toward a processor region. The duct also has at least one exit cooling duct section for the cooling airflow extending from the inlet cooling duct section and focused toward a component region, wherein the cooling airflow is successively transportable through the processor region followed by the component region. A processor-based system having a focused cooling duct. The focused cooling duct comprises an inlet cooling duct section for a cooling airflow having a fan receptacle, and a plurality of exit cooling duct sections for the cooling airflow extending from the inlet cooling duct section and focused toward component regions, wherein the cooling airflow is successively transportable through the inlet cooling duct section followed by the plurality of exit cooling duct sections. The processor-based system also comprises a plurality of components disposed in the component regions.

    摘要翻译: 用于冷却基于处理器的设备中的多个组件的管道。 管道具有用于朝着处理器区域聚焦的冷却气流的入口冷却管道部分。 管道还具有至少一个出口冷却管道部分,用于从入口冷却管道部分延伸并且朝向部件区域聚焦的冷却气流,其中冷却气流可依次传送通过处理器区域,随后是部件区域。 基于处理器的系统具有聚焦的冷却管道。 聚焦冷却管道包括用于具有风扇容器的冷却气流的入口冷却管道部分和用于从入口冷却管道部分延伸并朝向部件区域聚焦的冷却气流的多个出口冷却管道部分,其中冷却气流相继 可通过入口冷却管道部分运送,随后是多个出口冷却管段。 基于处理器的系统还包括设置在组件区域中的多个组件。