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公开(公告)号:US06639008B2
公开(公告)日:2003-10-28
申请号:US09994072
申请日:2001-11-27
IPC分类号: C08L8300
CPC分类号: C09D183/04 , C08K3/013
摘要: A silicone composition that includes at least one functionalized polydiorganosiloxane, at least one cure catalyst, at least one reactive diluant, and at least one thermally conductive filler is provided in the present invention. Further embodiments of the present invention include a method for substantially increasing the thermal conductivity of a silicone composition and a thermal interface material containing the aforementioned silicone composition.
摘要翻译: 在本发明中提供了包含至少一种官能化聚二有机硅氧烷,至少一种固化催化剂,至少一种反应性稀释剂和至少一种导热填料的硅氧烷组合物。 本发明的另外的实施方案包括用于显着增加含硅组合物和含有上述有机硅组合物的热界面材料的热导率的方法。