公开(公告)号：US20060057872A1

公开(公告)日：2006-03-16

申请号：US10941469

申请日：2004-09-15

申请人： Suang Ho ,  Soon Chung ,  Wiling Tan

发明人： Suang Ho ,  Soon Chung ,  Wiling Tan

IPC分类号： H01R13/648

CPC分类号： H01R12/718 ,  H05K3/3405

摘要： A low-profile, insert molded contact block and corresponding printed circuit board assembly are provided for coupling electronic circuitry disposed on printed wiring boards to external electronic devices. The contact block includes a plurality of L-shaped, metal contacts insert molded into a housing. The housing includes bracing members that circumscribe the metal contacts so that at least a portion of the front and rear faces of the metal contacts are exposed between the bracing members. The contact block may be coupled to a printed wiring board in an automated, reflow solder process utilizing automated pick and place equipment. The contact block is placed on the printed wiring board such that the metal contacts are seated on conductive pads with solder paste disposed thereon. The resulting assembly may then be heated in a reflow oven to permanently affix the metal contacts to the conductive pads. The contact block, which can be on the order of 0.6 millimeters thick, can significantly reduce the overall size of the host electronic device.

摘要翻译： 提供了一种小型嵌入式模制接触块和相应的印刷电路板组件，用于将设置在印刷线路板上的电子电路耦合到外部电子设备。 接触块包括模制在壳体中的多个L形金属触点插入件。 壳体包括支撑构件，其围绕金属触点，使得金属触头的前表面和后表面的至少一部分暴露在支撑构件之间。 接触块可以利用自动拾取和放置设备以自动回流焊接工艺耦合到印刷线路板。 接触块被放置在印刷线路板上，使得金属触点位于其上布置有焊膏的导电焊盘上。 然后可以在回流炉中加热所得到的组件以将金属触点永久地固定到导电焊盘。 接触块可以在0.6毫米厚的数量级，可以显着降低主机电子设备的总体尺寸。