公开(公告)号：US08324302B2

公开(公告)日：2012-12-04

申请号：US12707689

申请日：2010-02-18

申请人： Thangavelu Asokan ,  Sujatha Pushpakanth ,  Shalini Thimmegowda

发明人： Thangavelu Asokan ,  Sujatha Pushpakanth ,  Shalini Thimmegowda

IPC分类号： C08K3/18

CPC分类号： H01B3/20

摘要： A method is provided that includes providing a resin in liquid form. The resin can be partially cured, and subsequent to partially curing the resin, the resin can be mixed with filler particles. The resin and filler particles can be mixed, say, in a planetary mixer, and can be exposed to an ambient pressure less than atmospheric pressure during mixing. Subsequent to mixing the resin and filler particles, the resin can be fully cured. The fully-cured resin can be disposed between first and second conductive components configured to be maintained at different potentials, such as between a phase conductor and a ground conductor.

摘要翻译： 提供了一种包括提供液体形式的树脂的方法。 树脂可以部分固化，并且在树脂部分固化之后，树脂可以与填料颗粒混合。 树脂和填料颗粒可以在行星式混合器中混合，并且可以在混合期间暴露于小于大气压的环境压力下。 在混合树脂和填料颗粒之后，树脂可以完全固化。 完全固化的树脂可以设置在构造成保持在不同电位的第一和第二导电部件之间，例如在相导体和接地导体之间。

公开(公告)号：US20110198545A1

公开(公告)日：2011-08-18

申请号：US12707689

申请日：2010-02-18

申请人： Thangavelu Asokan ,  Sujatha Pushpakanth ,  Shalini Thimmegowda

发明人： Thangavelu Asokan ,  Sujatha Pushpakanth ,  Shalini Thimmegowda

IPC分类号： H01B3/20

CPC分类号： H01B3/20

摘要： A method is provided that includes providing a resin in liquid form. The resin can be partially cured, and subsequent to partially curing the resin, the resin can be mixed with filler particles. The resin and filler particles can be mixed, say, in a planetary mixer, and can be exposed to an ambient pressure less than atmospheric pressure during mixing. Subsequent to mixing the resin and filler particles, the resin can be fully cured. The fully-cured resin can be disposed between first and second conductive components configured to be maintained at different potentials, such as between a phase conductor and a ground conductor.

摘要翻译： 提供了一种包括提供液体形式的树脂的方法。 树脂可以部分固化，并且在树脂部分固化之后，树脂可以与填料颗粒混合。 树脂和填料颗粒可以在行星式混合器中混合，并且可以在混合期间暴露于小于大气压的环境压力下。 在混合树脂和填料颗粒之后，树脂可以完全固化。 完全固化的树脂可以设置在构造成保持在不同电位的第一和第二导电部件之间，例如在相导体和接地导体之间。