Method for encapsulation of light emitting polymer devices
    2.
    发明授权
    Method for encapsulation of light emitting polymer devices 有权
    封装发光聚合物器件的方法

    公开(公告)号:US07261795B2

    公开(公告)日:2007-08-28

    申请号:US10745953

    申请日:2003-12-24

    IPC分类号: B29C65/00

    摘要: A cost effective manufacturing process encapsulates a light emitting polymer (LEP) device between two flexible sheet materials, where one sheet may act as the substrate for the LEP device and the other sheet may act as a cover for the LEP device, and at least one of the sheets is transparent. Both encapsulating sheets and, as required, an adhesive system binding the sheets together provide sufficient environmental barriers with low moisture vapor transmission rates (MVTR) and oxygen transmission rates (OTR). The encapsulating sheets may, for example, be laminated together, sandwiching the LEP device in a vacuum, or oxygen/moisture free, and inert gas environment. Prior to encapsulation the LEP device may be heated and placed in a vacuum to remove moisture, air and residual solvents. The process may also be designed for roll to roll, sometimes called web based processing, where the LEP device and/or encapsulating sheet material are in a continuous roll format with an adhesive with low air permittivity, such as some UV or thermal curable epoxies, or a melt lamination process used to attach the encapsulating sheets. For LEP devices with short lifetime requirements, the encapsulating material may be in liquid form and applied by spraying, dipping, doctor balding, and the like, or printing, such as screen printing, roller coating or lithographic application in single or multiple layers. Such material may also contain desiccants to further remove water and/or oxygen.

    摘要翻译: 成本有效的制造方法将发光聚合物(LEP)装置封装在两个柔性片材之间,其中一个片材可以用作LEP装置的基底,另一个片材可以用作LEP装置的覆盖物,并且至少一个 的纸张是透明的。 根据需要,两个密封片和根据需要的粘合剂系统一起提供足够的环境屏障,具有低的蒸气透过率(MVTR)和氧气透过率(OTR)。 封装片可以例如层压在一起,将LEP装置夹在真空中,或者不含氧气和无湿气体的惰性气体环境中。 在封装之前,可以将LEP装置加热并置于真空中以除去水分,空气和残余溶剂。 该方法还可以被设计用于卷对卷,有时称为基于网的处理,其中LEP装置和/或封装片材料具有连续卷筒形式,具有低空气介电常数的粘合剂,例如一些UV或可热固化的环氧树脂, 或用于附接封装片的熔融层压工艺。 对于具有短寿命要求的LEP装置,封装材料可以是液体形式,并通过喷涂,浸渍,刮刀打包等进行涂布,或者以单层或多层印刷,如丝网印刷,辊涂或光刻涂布。 这种材料还可含有进一步除去水和/或氧的干燥剂。