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公开(公告)号:US06614743B1
公开(公告)日:2003-09-02
申请号:US09710995
申请日:2000-11-09
IPC分类号: G11B700
CPC分类号: G11B7/131 , G11B7/0903 , G11B7/0912 , G11B7/123 , G11B7/13 , G11B7/1353 , G11B7/1381 , G11B2007/0006
摘要: A semiconductor laser device includes a semiconductor laser element, a light beam branching element for branching a light beam emitted from the semiconductor laser element and reflected by an optical recording medium into a plurality of light beams, a light beam reflector for reflecting the light beam branched by the light beam branching element, and a photodetector portion for detecting the light beam reflected by the light beam reflector. The light beam branching element and the photodetector portion are formed on the same substrate. The miniature semiconductor laser device can be assembled without complicated position adjustment and has less deterioration of characteristics arising from misregistration during and after assembly.
摘要翻译: 半导体激光器件包括半导体激光元件,用于将从半导体激光元件发出的光束分支并由光学记录介质反射成多个光束的光束分支元件,用于反射光束分支的光束反射器 由光束分支元件和用于检测由光束反射器反射的光束的光电检测器部分。 光束分支元件和光电检测器部分形成在相同的基板上。 微型半导体激光装置可以在没有复杂的位置调整的情况下进行组装,并且在组装期间和组装之后由于配准不良引起的特性劣化较少。