公开(公告)号：US20130165312A1

公开(公告)日：2013-06-27

申请号：US13821622

申请日：2011-09-08

申请人： Takako Komai ,  Takashi Murata ,  Masahiro Yodogawa

发明人： Takako Komai ,  Takashi Murata ,  Masahiro Yodogawa

IPC分类号： C03C3/091 ,  C03C3/087 ,  C03C3/085

CPC分类号： H01L27/14683 ,  C03C1/00 ,  C03C3/085 ,  C03C3/087 ,  C03C3/091 ,  H01L27/14618 ,  H01L2924/0002 ,  H01L2924/00

摘要： A cover glass for semiconductor package having thermal expansion coefficient conformable to plastic packages and allowing accurate detection of existence of foreign substances, dusts, etc. in an imaging test always having a low emission amount of alpha-ray, and a related production method. The cover glass comprises, in terms of percentage by mass, of from 58 to 75% of SiO2, of from 1.1 to 20% of Al2O3, of from 0 to 10% of B2O3, of from 0.1 to 20% of Na2O, of from 0 to 11% of K2O, and of from 0 to 20% of alkaline earth metal oxide. The cover glass has average thermal expansion coefficient of from 90 to 180×10−7/° C. in the temperature range of from 30 to 380° C., a Young's modulus of 68 GPa or more, and an emission amount of alpha-ray from the glass of 0.05 c/cm2·hr or less.

摘要翻译： 一种用于半导体封装的玻璃罩，其具有符合塑料封装的热膨胀系数，并且允许在始终具有低发射量的α射线的成像测试中精确检测异物，灰尘等的存在以及相关的制造方法。 覆盖玻璃以质量％计含有SiO 2的58〜75％，Al 2 O 3的1.1〜20％，B 2 O 3的0〜10％，Na 2 O的0.1〜20％ 0〜11％的K2O，和0〜20％的碱土金属氧化物。 覆盖玻璃在30〜380℃的温度范围内的平均热膨胀系数为90〜180×10-7 /℃，杨氏模量为68GPa以上， 从0.05c / cm 2·小时以下的玻璃射出。

公开(公告)号：US09269742B2

公开(公告)日：2016-02-23

申请号：US13821622

申请日：2011-09-08

申请人： Takako Komai ,  Takashi Murata ,  Masahiro Yodogawa

发明人： Takako Komai ,  Takashi Murata ,  Masahiro Yodogawa

IPC分类号： C03C3/091 ,  C03C3/087 ,  C03C3/085 ,  H01L27/146 ,  C03C1/00

CPC分类号： H01L27/14683 ,  C03C1/00 ,  C03C3/085 ,  C03C3/087 ,  C03C3/091 ,  H01L27/14618 ,  H01L2924/0002 ,  H01L2924/00

摘要： A cover glass for semiconductor package having thermal expansion coefficient conformable to plastic packages and allowing accurate detection of existence of foreign substances, dusts, etc. in an imaging test always having a low emission amount of alpha-ray, and a related production method. The cover glass comprises, in terms of percentage by mass, of from 58 to 75% of SiO2, of from 1.1 to 20% of Al2O3, of from 0 to 10% of B2O3, of from 0.1 to 20% of Na2O, of from 0 to 11% of K2O, and of from 0 to 20% of alkaline earth metal oxide. The cover glass has average thermal expansion coefficient of from 90 to 180×10−7/° C. in the temperature range of from 30 to 380° C., a Young's modulus of 68 GPa or more, and an emission amount of alpha-ray from the glass of 0.05 c/cm2·hr or less.

摘要翻译： 一种用于半导体封装的玻璃罩，其具有符合塑料封装的热膨胀系数，并且允许在始终具有低发射量的α射线的成像测试中精确检测异物，灰尘等的存在以及相关的制造方法。 覆盖玻璃以质量％计含有SiO 2的58〜75％，Al 2 O 3的1.1〜20％，B 2 O 3的0〜10％，Na 2 O的0.1〜20％ 0〜11％的K2O，和0〜20％的碱土金属氧化物。 覆盖玻璃在30〜380℃的温度范围内的平均热膨胀系数为90〜180×10-7 /℃，杨氏模量为68GPa以上， 从0.05c / cm 2·小时以下的玻璃射出。