公开(公告)号：US20190196396A1

公开(公告)日：2019-06-27

申请号：US16226932

申请日：2018-12-20

申请人： Yuta UEDA ,  Makoto YOSHIOKA ,  Kazuhiko KOBAYASHI ,  Takushi SAITO

发明人： Yuta UEDA ,  Makoto YOSHIOKA ,  Kazuhiko KOBAYASHI ,  Takushi SAITO

IPC分类号： G03G21/20

摘要： According to an embodiment, an electronic device includes a heat source, a discharge path, a wall internal space, and a heat conductor. The discharge path is configured to guide a gas toward the outside of the device. The wall internal space is surrounded by walls, extends vertically, and is open to a space outside the device via an upper opening and a lower opening that are in different vertical positions. The heat conductor includes a heat absorber that is positioned in the discharge path and a heat dissipater that is positioned in the wall internal space.

公开(公告)号：US10705482B2

公开(公告)日：2020-07-07

申请号：US16226932

申请日：2018-12-20

申请人： Yuta Ueda ,  Makoto Yoshioka ,  Kazuhiko Kobayashi ,  Takushi Saito

发明人： Yuta Ueda ,  Makoto Yoshioka ,  Kazuhiko Kobayashi ,  Takushi Saito

IPC分类号： G03G15/20 ,  G03G21/20

摘要： According to an embodiment, an electronic device includes a heat source, a discharge path, a wall internal space, and a heat conductor. The discharge path is configured to guide a gas toward the outside of the device. The wall internal space is surrounded by walls, extends vertically, and is open to a space outside the device via an upper opening and a lower opening that are in different vertical positions. The heat conductor includes a heat absorber that is positioned in the discharge path and a heat dissipater that is positioned in the wall internal space.