公开(公告)号：US07172785B2

公开(公告)日：2007-02-06

申请号：US10332922

申请日：2001-07-11

申请人： G. Alan Thompson ,  Theresa M Anderson ,  David E. Marx

发明人： G. Alan Thompson ,  Theresa M Anderson ,  David E. Marx

IPC分类号： B06B1/20 ,  B05D1/18 ,  B05D3/10

CPC分类号： C23C18/42 ,  C23C18/1669 ,  C23C18/31 ,  H05K3/187

摘要： The invention relates to a process for depositing a metal on a material. The process comprises the steps of: immersing the material in deposition solution comprising the metal; inducing a material vibration in the deposition solution having a frequency corresponding to a resonance frequency of the material; including a solution vibration in the deposition solution in a direction non-parallel to the material vibration, said solution vibration having a frequency corresponding to the a resonance frequency of the deposition solution, whereby said metal is deposited onto the material. This process results in deposition of metal from the plating bath on the material in a controlled and substantially uniform thickness.

摘要翻译： 本发明涉及在材料上沉积金属的方法。 该方法包括以下步骤：将材料浸入包含金属的沉积溶液中; 在沉积溶液中引起具有对应于材料的共振频率的频率的材料振动; 包括沉积溶液中在与材料振动不平行的方向上的溶液振动，所述溶液振动具有对应于沉积溶液的共振频率的频率，由此所述金属沉积到材料上。 该过程导致金属从电镀浴中以受控且基本均匀的厚度沉积在材料上。