公开(公告)号：US20060054564A1

公开(公告)日：2006-03-16

申请号：US11222024

申请日：2005-09-08

申请人： Peter Woyciesjes ,  Aleksei Gershun ,  Filipe Marinho ,  Thomas Kalagher ,  Bo Yang

发明人： Peter Woyciesjes ,  Aleksei Gershun ,  Filipe Marinho ,  Thomas Kalagher ,  Bo Yang

IPC分类号： C02F1/00 ,  C02F5/08

CPC分类号： H01M8/04029 ,  C09K5/10 ,  C23F11/08 ,  C23F11/10 ,  C23F11/149 ,  C23F14/02 ,  Y02P70/56

摘要： Disclosed is a corrosion inhibitor for use in heat transfer fluids having a conductivity of less than 200 μS/cm, the corrosion inhibitor having an azole compound, and at least one of a siloxane based surfactant, colloidal silica, or a mixture thereof. Also disclosed is a corrosion inhibiting heat transfer fluid, the heat transfer fluid having a conductivity of no more than or equal to 200 μS/cm and comprising the disclosed corrosion inhibitor. Also provided is an assembly comprising an alternative power source and a heat transfer system in thermal communication with the alternative power source, the heat transfer system comprising the disclosed corrosion inhibiting heat transfer fluid. In addition, a method of making a corrosion inhibiting heat transfer fluid is disclosed wherein the disclosed corrosion inhibitor is added to heat transfer fluid having a conductivity of less than 200 μS/cm.

摘要翻译： 公开了一种用于导电率小于200μS/ cm 2的传热流体的腐蚀抑制剂，具有唑化合物的缓蚀剂和至少一种硅氧烷基表面活性剂，胶体二氧化硅或其混合物。 还公开了一种腐蚀抑制传热流体，该传热流体的导电率不大于或等于200μS/ cm，并且包括所公开的腐蚀抑制剂。 还提供了一种组件，其包括替代电源和与替代电源热连通的传热系统，所述传热系统包括所公开的腐蚀抑制传热流体。 此外，公开了一种制造腐蚀抑制传热流体的方法，其中将所公开的腐蚀抑制剂加入导电率小于200μS/ cm的传热流体中。