公开(公告)号：US06758934B2

公开(公告)日：2004-07-06

申请号：US10305636

申请日：2002-11-27

申请人： Jeanne Marie Saldanha Singh ,  Thomas Lee Smart

发明人： Jeanne Marie Saldanha Singh ,  Thomas Lee Smart

IPC分类号： B32B3118

CPC分类号： B41J2/17536 ,  Y10T156/1062 ,  Y10T156/1064 ,  Y10T156/108 ,  Y10T156/1082 ,  Y10T156/12 ,  Y10T156/1322

摘要： The invention relates to a method for attaching microelectronic devices, circuit boards and the like to a surface, and is particularly suitable for attaching a plurality of a semiconductor chips to an ink jet pen body. The method includes the steps of (a) providing a sheet of a thin film adhesive material having a first surface and a second surface opposite the first surface, the second surface being releasably attached to a carrier web; (b) simultaneously making a plurality of cuts in the sheet of thin film adhesive material, the cuts extending from the first surface to an interface between the second surface and the carrier web without significantly extending into the carrier web to provide one or more cut portions of adhesive film; (c) removing each cut portion of adhesive film from the carrier web; (d) engaging the second surface of each of the cut portions with predetermined locations on a receiving surface; and (e) providing one or more semiconductor chips in a desirably aligned configuration with respect to the predetermined locations and contacting each semiconductor chip with first surface of each of the cut portions. Use of the method and apparatus of the invention provides significant improvement in the application of adhesive films to surfaces in electronic component assembly.

摘要翻译： 本发明涉及一种将微电子器件，电路板等附着在表面上的方法，特别适用于将多个半导体芯片附着到喷墨笔体上。 该方法包括以下步骤：（a）提供具有第一表面和与第一表面相对的第二表面的薄膜粘合材料片，所述第二表面可释放地附接到载体网; （b）同时在薄膜粘合剂材料片上进行多个切口，切口从第一表面延伸到第二表面和载体网之间的界面，而不会显着延伸到载体网中以提供一个或多个切割部分 的胶膜; （c）从载体网上去除粘合膜的每个切割部分; （d）将每个切割部分的第二表面与接收表面上的预定位置接合; 和（e）相对于预定位置提供期望对准的一个或多个半导体芯片，并使每个半导体芯片与每个切割部分的第一表面接触。 使用本发明的方法和装置提供了在电子部件组件中将粘合剂膜应用于表面方面的显着改进。