Rails for semiconductor wafer carriers
    1.
    发明申请
    Rails for semiconductor wafer carriers 审中-公开
    半导体晶圆载体的导轨

    公开(公告)号:US20050205502A1

    公开(公告)日:2005-09-22

    申请号:US10803820

    申请日:2004-03-18

    IPC分类号: H01L21/673 A47G19/08

    CPC分类号: H01L21/67309

    摘要: A rail is provided for use as a support in an apparatus for holding a plurality of semiconductor wafers. The rail has a plurality of teeth arranged in a vertical column, such that the space between a top surface of one tooth and a bottom surface of the next higher adjacent tooth forms a slot for receiving a portion of a semiconductor wafer. A support structure for supporting the wafer is located on the top surface of substantially all teeth that form the bottom of a slot, the support structure having sidewalls and an upper surface spaced from the top surface. On each support structure, a radius is formed at each intersection of the sidewalls and the upper surface. The support structure extends for at least approximately 50% of the length of each tooth.

    摘要翻译: 在用于保持多个半导体晶片的装置中提供轨道用作支撑件。 轨道具有排列成垂直列的多个齿,使得一个齿的顶表面与下一较高相邻齿的底表面之间的空间形成用于接纳半导体晶片的一部分的槽。 用于支撑晶片的支撑结构位于形成槽底部的基本上所有齿的顶表面上,支撑结构具有侧壁和与顶表面间隔开的上表面。 在每个支撑结构上,在侧壁和上表面的每个交叉处形成半径。 支撑结构延伸至每个齿的长度的至少约50%。