公开(公告)号：US06201558B1

公开(公告)日：2001-03-13

申请号：US09305105

申请日：1999-05-04

申请人： Takashi Shirakawa ,  Toshifumi Nakatani ,  Shuuichi Usami ,  Satoru Sasaki ,  Tomonari Nanbu ,  Hirotoshi Terao

发明人： Takashi Shirakawa ,  Toshifumi Nakatani ,  Shuuichi Usami ,  Satoru Sasaki ,  Tomonari Nanbu ,  Hirotoshi Terao

IPC分类号： B41J2335

CPC分类号： B41J2/3351 ,  B41J2/3355 ,  B41J2/3357 ,  B41J2/345

摘要： A thermal head includes a heat dissipating substrate, a heat-insulating layer formed thereon, a common lead layer formed thereon, an insulating interlayer formed thereon, a plurality of heating elements provided on the insulating interlayer, a common electrode connected to one end of each heating element, and a plurality of discrete electrodes connected to the other ends of the heating elements. The heating elements are connected to each other via the common electrode, and the common electrode is electrically connected to the common lead layer through a contact hole provided in the insulating interlayer. The common lead layer includes a thin region below the heating elements and a thick region.

摘要翻译： 热敏头包括散热衬底，形成在其上的绝热层，形成在其上的公共引线层，形成在其上的绝缘夹层，设置在绝缘中间层上的多个加热元件，连接到每个的一端的公共电极 加热元件和连接到加热元件的另一端的多个分立电极。 加热元件通过公共电极彼此连接，公共电极通过设置在绝缘中间层中的接触孔与公共引线层电连接。 公共引线层包括加热元件下面的薄区域和厚区域。