公开(公告)号：US06291316B1

公开(公告)日：2001-09-18

申请号：US09233706

申请日：1999-01-19

Applicant: Christopher Michael Knowles ,  Yih-Yin Lin ,  Tung-Chieh Lin ,  William John Nelson ,  Hung-Ping Tsai ,  Richard Sean O'Rourke

Inventor： Christopher Michael Knowles ,  Yih-Yin Lin ,  Tung-Chieh Lin ,  William John Nelson ,  Hung-Ping Tsai ,  Richard Sean O'Rourke

IPC: H01L2146

CPC classification number: H01L23/3178 ,  H01L21/76224 ,  H01L2924/0002 ,  Y10S438/958 ,  H01L2924/00

Abstract: A wafer-level process for fabricating a plurality of passivated semiconductor devices comprising the steps of providing a semiconductor wafer on that at least one p-n junction is formed, Cutting a plurality of grooves in said wafer to expose said at least one p-n junction, wherein each of said grooves extends partly through the wafer and has a depth that is enough to expose said at least one p-n junction, applying a passivating material into said grooves and curing the material. The grooves can be formed by using a disc saw having a blade, by performing a sandblasting operation within a controlled operation time, or by performing a photolithographically chemical etching process. The passivating material is either screen-printed or pin-dispensed into the grooves. A dicing operation can be subsequently proceeded to divide the wafer into individual chips for subsequent fabrication into completed semiconductor devices.

Abstract translation: 一种用于制造多个钝化半导体器件的晶片级工艺，包括以下步骤：在该至少一个pn结上提供半导体晶片;在所述晶片中切割多个凹槽以暴露所述至少一个pn结，其中每个 所述凹槽部分地延伸穿过晶片并且具有足以露出所述至少一个pn结的深度，将钝化材料施加到所述凹槽中并固化材料。 可以通过使用具有叶片的盘锯，通过在受控的操作时间内进行喷砂操作，或通过进行光刻化学蚀刻工艺来形成凹槽。 钝化材料被丝网印刷或销钉分配到凹槽中。 随后可以进行切割操作以将晶片分成单个芯片，以便随后制造成完整的半导体器件。