公开(公告)号：US5300798A

公开(公告)日：1994-04-05

申请号：US978293

申请日：1992-11-17

申请人： Kouichi Yamazaki ,  Setsuo Ogura ,  Kazuyuki Kamegaki ,  Kenya Yamauchi ,  Yukinori Kitamura ,  Tuyoshi Nagase

发明人： Kouichi Yamazaki ,  Setsuo Ogura ,  Kazuyuki Kamegaki ,  Kenya Yamauchi ,  Yukinori Kitamura ,  Tuyoshi Nagase

IPC分类号： H01L21/3205 ,  H01L21/768 ,  H01L21/82 ,  H01L23/52 ,  H01L23/528 ,  H01L27/02

CPC分类号： H01L23/5286 ,  H01L27/0207 ,  H01L2924/0002 ,  H01L2924/3011

摘要： When a semiconductor integrated circuit device having a wiring structure of three or more layers is hierarchically considered as a collection of a plurality of functional blocks, each functional block is internally connected by wirings in the first wiring layer, in which wirings have their main extended direction prescribed to be the X-direction, and wirings in the second wiring layer, in which wirings have their main extended direction prescribed to be the Y-direction, formed over the first wiring layer. Wirings in the third wiring layer, in which wirings have their main extended direction prescribed to be the same as the wirings in the second wiring layer, formed over the second wiring layer, together with wirings in the first and second wiring layer, are used as signal wirings between functional blocks, while the wirings in the third wiring layer are used as power supply wirings for providing power supply to functional blocks. As the power supply paths to functional blocks, a plurality of power supply wirings are branched off from the power supply electrode such as a power supply pad and terminated there. The power supply electrode on the high voltage side and the power supply electrode on the low voltage side are disposed separately at opposing edge portions of the semiconductor substrate and the power supply wirings proceeding therefrom to their target functional blocks are bent in the vicinity of the edge portion of the semiconductor substrate and therefrom extended straight to the target points.

摘要翻译： 当具有三层以上的布线结构的半导体集成电路器件被分级地考虑为多个功能块的集合时，每个功能块通过布线在第一布线层中的布线内部连接，其中布线具有其主要延伸方向 规定为X方向，并且在第一布线层上形成第二布线层中的布线，其中布线的主要延伸方向规定为Y方向。 将在第二布线层中形成的与第二布线层中的配线相同的布线的第三布线层中的布线与第一布线层和第二布线层中的布线一起用作布线层的布线 功能块之间的信号布线，而第三布线层中的布线用作向功能块提供电源的电源布线。 作为对功能块的供电路径，多个电源配线从诸如电源焊盘的电源电极分支，并在那里终止。 高电压侧的电源电极和低电压侧的电源电极分别设置在半导体基板的相对的边缘部分，并且从其到达其目标功能块的电源布线在边缘附近弯曲 半导体衬底的一部分并且直接延伸到目标点。