公开(公告)号：US06809130B2

公开(公告)日：2004-10-26

申请号：US10384752

申请日：2003-03-11

Applicant: Kuo-Chan Chiou ,  Tzong-Ming Lee ,  Feng-Po Tseng ,  Lu-Shih Liao ,  Jia-Chi Huang ,  Tzu-Ting Lin

Inventor： Kuo-Chan Chiou ,  Tzong-Ming Lee ,  Feng-Po Tseng ,  Lu-Shih Liao ,  Jia-Chi Huang ,  Tzu-Ting Lin

IPC: C08K336

CPC classification number: H05K1/0326 ,  C08G59/182

Abstract: A halogen-free, phosphorus-free poly-cyclic compound is used a flame retardant. This compound has amide and hydroxy groups, and thus it is able to react with an epoxy resin to form a reactive type flame-retardant advanced epoxy resin. The advanced epoxy resin together with an inorganic additive are mixed with an epoxy resin to form a halogen-free, phosphorus-free flame-retardant epoxy composition, which can be used in the manufacture of a printed circuit board and as an encapsulation material for a semi-conductor device.