公开(公告)号：US06467545B1

公开(公告)日：2002-10-22

申请号：US09563471

申请日：2000-05-02

Applicant: Gouri Venkataraman ,  Vidish Subba Rao ,  Robert Henry Wittman ,  Richard Bryan Lee

Inventor： Gouri Venkataraman ,  Vidish Subba Rao ,  Robert Henry Wittman ,  Richard Bryan Lee

IPC: E21B1701

CPC classification number: E21B17/028 ,  E21B17/01 ,  E21B17/017 ,  F16L7/00 ,  F16L25/03 ,  F16L57/00

Abstract: A monolithic isolation stress joint is disclosed having a first conduit element, a first insulating joint assembly, and a stress joint connected to the first conduit element through the first insulating joint assembly. The stress joint is formed of a material which has advantageous elastic flexure characteristics but which is electrochemically active with respect to the first conduit element from which it is electrically isolated by the first insulating joint assembly. A second conduit element is connected to the stress joint through a second insulating joint assembly, the second conduit element being formed of a material which is electrochemically active with respect to the stress joint and which is electrically isolated therefrom with the second insulating joint.

Abstract translation: 公开了一种单片隔离应力接头，其具有第一导管元件，第一绝缘接头组件和通过第一绝缘接头组件连接到第一导管元件的应力接头。 应力接头由具有有利的弹性弯曲特性但相对于第一导管元件电化学活性的材料形成，该第一导管元件由第一导电元件由第一绝缘接头组件电隔离。 第二导管元件通过第二绝缘接头组件连接到应力接头，第二导管元件由相对于应力接头电化学活性且与第二绝缘接头电隔离的材料形成。