公开(公告)号：US20100183871A1

公开(公告)日：2010-07-22

申请号：US12561369

申请日：2009-09-17

申请人： WAN-CHUN PENG ,  GANG XIONG ,  CHWAN-HWA CHIANG ,  CHUN-MAN HON ,  FENG-YUEN DAI

发明人： WAN-CHUN PENG ,  GANG XIONG ,  CHWAN-HWA CHIANG ,  CHUN-MAN HON ,  FENG-YUEN DAI

IPC分类号： B32B15/08 ,  B05D3/00

CPC分类号： C23C14/06 ,  C23C14/20 ,  Y10T428/265 ,  Y10T428/31678

摘要： A nonconductive surface metallization method of plastic substrate comprising: providing a plastic substrate; and forming a black-colored and nonconductive alloy coating on the plastic substrate surface by a vacuum evaporating process, the alloy coating being formed by a target comprising a first material and a second material, the first material being a steel, the second material being selected from a group consisting of indium, tin, aluminium and silicon dioxide. A plastic article has a black-colored and nonconductive alloy coating is provided in the present disclosure.

摘要翻译： 1.一种塑料基板的非导电表面金属化方法，包括：提供塑料基板; 以及通过真空蒸发法在所述塑料基材表面上形成黑色和非导电合金涂层，所述合金涂层由包含第一材料和第二材料的靶形成，所述第一材料为钢，所述第二材料被选择 由铟，锡，铝和二氧化硅组成的组。 在本公开中提供了塑料制品具有黑色和非导电合金涂层。