Electroluminescent display device
    1.
    发明授权
    Electroluminescent display device 失效
    电致发光显示装置

    公开(公告)号:US06882106B2

    公开(公告)日:2005-04-19

    申请号:US10777092

    申请日:2004-02-13

    申请人: Wen-Ho Kao

    发明人: Wen-Ho Kao

    IPC分类号: G09F13/22 H01J17/00 H05B33/02

    CPC分类号: G09F13/22

    摘要: An electroluminescent panel is provided. The electroluminescent panel comprises a front electrode layer; a luminescent layer, formed on the front electrode layer; a reflective layer, formed on the luminescent layer; a back electrode layer having at least a pattern or letters for being displayed by the electroluminiscent panel; an insulating layer, adhered onto the back electrode layer, wherein the insulating layer comprises a plurality of contact holes, and wherein the contact holes are disposed according to the pattern or letters of the back electrode layer.

    摘要翻译: 提供了电致发光面板。 电致发光面板包括前电极层; 形成在前电极层上的发光层; 形成在发光层上的反射层; 具有至少一个用于由电致发光面板显示的图案或字母的背面电极层; 绝缘层,粘合到所述背面电极层上,其中所述绝缘层包括多个接触孔,并且其中所述接触孔根据所述背面电极层的图案或字母设置。

    Electrical luminescent lamp processing method
    2.
    发明授权
    Electrical luminescent lamp processing method 失效
    电子发光灯加工方法

    公开(公告)号:US06767268B2

    公开(公告)日:2004-07-27

    申请号:US10153678

    申请日:2002-05-24

    申请人: Wen-Ho Kao

    发明人: Wen-Ho Kao

    IPC分类号: H01J924

    CPC分类号: H05B33/10

    摘要: An electrical luminescent lamp processing process includes the step of using a machine tool to process a design in the back electrode layer of an electrical luminescent lamp, the step of cutting contact holes in an electrically insulative layer subject to a predetermined design and then adhering the electrically insulative layer to the back electrode layer, and the step of adhering a conductor layer to the electrically insulative layer opposite to the back electrode layer over the contact holes for transmitting electricity to the design in the back electrode layer.

    摘要翻译: 一种电致发光灯处理方法,其特征在于,包括使用机床来处理电致发光灯的背面电极层的设计的步骤,在预定的设计下切断电绝缘层的接触孔的步骤, 绝缘层,以及将导体层粘接到与背面电极层相反的电绝缘层上的步骤,用于将电力传输到背面电极层中的设计的接触孔上。