专利检索 ap:"Wendy Luo" 第 1 页

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发明申请
METHODS AND APPARATUS TO MINIMIZE THE EFFECT OF TAPE TENSION IN ELECTRONIC DEVICE POLISHING 审中-公开
标题翻译：最小化电子设备抛光中贴片张力的影响的方法和设备

公开(公告)号：US20100105294A1

公开(公告)日：2010-04-29

申请号：US12603858

申请日：2009-10-22

申请人： Gary C. Ettinger , Wendy Luo , Antoine P. Manens

发明人： Gary C. Ettinger , Wendy Luo , Antoine P. Manens

IPC分类号： B24B9/02 , B24B21/02 , B24B21/20

CPC分类号： B24B21/002 , B24B9/065 , B24B21/20

摘要： Methods and apparatus are provided for reducing tension on a polishing roller. In some aspects, a polishing head may be provided that is adapted to contact a substrate. The polishing head includes: a polishing unit having a polisher and at least one pair of tension distributors adapted to reduce tension on the polisher; and one or more pairs feed guides. Numerous other aspects are provided.

摘要翻译： 提供了减少抛光辊张力的方法和装置。在一些方面，可以提供适于接触基底的抛光头。抛光头包括：具有抛光机的抛光单元和适于减小抛光机上的张力的至少一对张力分布器; 和一对或多对进给导轨。提供了许多其他方面。