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公开(公告)号：US20230405761A1
公开(公告)日：2023-12-21
申请号：US18076589
申请日：2022-12-07
发明人： Nario Yoshida
摘要： A polishing device according to the present invention includes: a plurality of workpiece holding units that respectively hold workpieces; a base part that is rotatable about a center axis, and is arranged such that the plurality of workpiece holding units are arranged mutually at an equal interval on an identical circumference at an arbitrary distance from the center axis; and a plurality of workpiece polishing units that polish polishing target surfaces of the workpieces held by the workpiece holding units, the base part rotates in one direction about the center axis to sequentially move the workpiece holding units that hold the workpieces to the plurality of polishing positions such that the plurality of workpiece polishing units polish the workpieces, and moves the workpieces polished by the plurality of workpiece polishing units to the workpiece exchange position, and exchanges the polished workpieces with a workpiece that is not yet polished.
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