公开(公告)号：US09196854B2

公开(公告)日：2015-11-24

申请号：US14196025

申请日：2014-03-04

申请人： Yasuhiko Takamatsu

发明人： Yasuhiko Takamatsu

IPC分类号： H01L51/50 ,  H01L27/32 ,  H01L51/56 ,  H01L51/52

CPC分类号： H01L51/5012 ,  H01L27/3241 ,  H01L51/524 ,  H01L51/56

摘要： An organic EL light emitting device and an organic EL light source device having the organic EL light emitting device are described. A method of manufacturing the organic EL light emitting device includes forming a scaling layer over a sealing layer base material by using at least one of chemical vapor deposition and physical vapor deposition, joining the sealing layer to an organic EL substrate having an organic EL device so as to cover the organic EL device, and removing the sealing layer base material to leave the sealing layer that covers the organic EL device.

摘要翻译： 描述有机EL发光器件和具有有机EL发光器件的有机EL光源器件。 制造有机EL发光器件的方法包括通过使用化学气相沉积和物理气相沉积中的至少一种在密封层基材上形成刻度层，将密封层连接到具有有机EL器件的有机EL衬底上 以覆盖有机EL器件，并且去除密封层基材以留下覆盖有机EL器件的密封层。

公开(公告)号：US20140252328A1

公开(公告)日：2014-09-11

申请号：US14196025

申请日：2014-03-04

申请人： Yasuhiko Takamatsu

发明人： Yasuhiko Takamatsu

IPC分类号： H01L51/50 ,  H01L27/32 ,  H01L51/56

CPC分类号： H01L51/5012 ,  H01L27/3241 ,  H01L51/524 ,  H01L51/56

摘要： An organic EL light emitting device and an organic EL light source device having the organic EL light emitting device are described. A method of manufacturing the organic EL light emitting device includes forming a scaling layer over a sealing layer base material by using at least one of chemical vapor deposition and physical vapor deposition, joining the sealing layer to an organic EL substrate having an organic EL device so as to cover the organic EL device, and removing the sealing layer base material to leave the sealing layer that covers the organic EL device.

摘要翻译： 描述有机EL发光器件和具有有机EL发光器件的有机EL光源器件。 制造有机EL发光器件的方法包括通过使用化学气相沉积和物理气相沉积中的至少一种在密封层基材上形成刻度层，将密封层连接到具有有机EL器件的有机EL衬底上 以覆盖有机EL器件，并且去除密封层基材以留下覆盖有机EL器件的密封层。

公开(公告)号：US4651164A

公开(公告)日：1987-03-17

申请号：US881527

申请日：1986-06-30

申请人： Shuro Abe ,  Yoshiro Yabuki ,  Yasuhiko Takamatsu ,  Takayuki Yamaguchi ,  Masatoshi Ohta ,  Eiji Nakamura

发明人： Shuro Abe ,  Yoshiro Yabuki ,  Yasuhiko Takamatsu ,  Takayuki Yamaguchi ,  Masatoshi Ohta ,  Eiji Nakamura

IPC分类号： H01L49/00 ,  B41J2/345 ,  B41J3/20

CPC分类号： B41J2/345

摘要： A thermal printhead for use in a thermal recording machine includes a substrate on which a plurality of heat-producing elements are formed in the form of a linear array and a plurality of I.C. driver chips provided along one side of the linear array, and the I.C. driver chip includes output pads formed in a line spaced apart from one another on its surface along one side thereof. Using such an I.C. driver chip, the linear array density of 8 elements/mm and thus recording density of 8 dots/mm is obtained.

摘要翻译： 在热敏记录机中使用的热敏打印头包括：基板，其上形成线形阵列形式的多个发热元件和多个发热元件。 线性阵列一侧提供的驱动器芯片，以及I.C. 驱动器芯片包括沿其一侧在其表面上彼此间隔开的线形成的输出焊盘。 使用这样一个 驱动器芯片，线阵列密度为8个元/ mm，因此记录密度为8个点/ mm。