公开(公告)号：US07485029B2

公开(公告)日：2009-02-03

申请号：US11882999

申请日：2007-08-08

申请人： Satoki Kanda ,  Harumichi Koyama ,  Masahiro Takeuchi ,  Yoichi Morozumi

发明人： Satoki Kanda ,  Harumichi Koyama ,  Masahiro Takeuchi ,  Yoichi Morozumi

IPC分类号： B24B7/00 ,  B24B9/00 ,  B24B57/02

CPC分类号： B24B37/015 ,  B24B37/08 ,  B24B57/02

摘要： The double face polishing apparatus is capable of controlling an amount of supplying slurry to a lower polishing plate. The double face polishing apparatus comprises: a lower polishing plate and an upper polishing plate; a carrier provided between the polishing plates, the carrier having a through-hole for holding a workpiece; a plate driving unit for rotating the polishing plates; a carrier driving unit for rotating the carrier; ring-shaped ducts coaxially provided to the upper polishing plate; a slurry supply source supplying slurry to the ring-shaped ducts; and supply pipes for supplying the slurry to the lower polishing plate. The slurry is supplied to each of coaxial polishing zones of the lower polishing plate via the corresponding ring-shaped ducts and the supply pipes.

摘要翻译： 双面抛光装置能够控制向下抛光板供给浆料的量。 双面抛光装置包括：下抛光板和上抛光板; 设置在所述研磨板之间的载体，所述载体具有用于保持工件的通孔; 用于旋转抛光板的板驱动单元; 用于使所述载体旋转的载体驱动单元; 同轴地设置到上抛光板的环形导管; 浆料供应源将浆料供应到环形管道; 并供应用于将浆料供应到下抛光板的管道。 通过相应的环形管道和供应管道将浆料供应到下抛光板的每个同轴抛光区域。

公开(公告)号：US20080057831A1

公开(公告)日：2008-03-06

申请号：US11882999

申请日：2007-08-08

申请人： Satoki Kanda ,  Harumichi Koyama ,  Masahiro Takeuchi ,  Yoichi Morozumi

发明人： Satoki Kanda ,  Harumichi Koyama ,  Masahiro Takeuchi ,  Yoichi Morozumi

IPC分类号： B24B49/14

CPC分类号： B24B37/015 ,  B24B37/08 ,  B24B57/02

摘要： The double face polishing apparatus is capable of controlling an amount of supplying slurry to a lower polishing plate. The double face polishing apparatus comprises: a lower polishing plate and an upper polishing plate; a carrier provided between the polishing plates, the carrier having a through-hole for holding a workpiece; a plate driving unit for rotating the polishing plates; a carrier driving unit for rotating the carrier; ring-shaped ducts coaxially provided to the upper polishing plate; a slurry supply source supplying slurry to the ring-shaped ducts; and supply pipes for supplying the slurry to the lower polishing plate. The slurry is supplied to each of coaxial polishing zones of the lower polishing plate via the corresponding ring-shaped ducts and the supply pipes.

摘要翻译： 双面抛光装置能够控制向下抛光板供给浆料的量。 双面抛光装置包括：下抛光板和上抛光板; 设置在所述研磨板之间的载体，所述载体具有用于保持工件的通孔; 用于旋转抛光板的板驱动单元; 用于使所述载体旋转的载体驱动单元; 同轴地设置到上抛光板的环形导管; 浆料供应源将浆料供应到环形管道; 并供应用于将浆料供应到下抛光板的管道。 通过相应的环形管道和供应管道将浆料供应到下抛光板的每个同轴抛光区域。