公开(公告)号：US20110034007A1

公开(公告)日：2011-02-10

申请号：US12837235

申请日：2010-07-15

申请人： Yoshiaki Yodo ,  Masaru Nakamura

发明人： Yoshiaki Yodo ,  Masaru Nakamura

IPC分类号： H01L21/304

CPC分类号： H01L21/78

摘要： A dividing method for a platelike workpiece having a two-layer structure such that a solder layer (metal layer) is formed on the back side of a wafer (substrate). First, a modified layer is formed in the wafer along each division line formed on the front side of the wafer. Thereafter, the workpiece is bent along each division line to thereby divide the wafer along each division line from the corresponding modified layer as a starting point and simultaneously form a weak portion in the solder layer along each division line. Thereafter, an expandion tape attached to the solder layer is expanded to apply an external force to the solder layer, thereby dividing the solder layer along each division line from the corresponding weak portion as a starting point. Thus, the workpiece is completely divided.

摘要翻译： 具有双层结构的板状工件的分割方法，使得在晶片（基板）的背面上形成焊料层（金属层）。 首先，沿着形成在晶片的前侧上的每个划分线，在晶片中形成改性层。 此后，工件沿着每个分割线弯曲，从而沿着每个分割线将晶片与相应的改性层作为起始点，并沿着分割线同时形成焊料层中的弱部分。 此后，扩大连接于焊料层的扩展带，以向焊料层施加外力，从而沿着每个划分线将焊料层与相应的弱部分划分为起点。 因此，工件完全分开。