System and method for integrating a dispatching system with multiple process lines in a semiconductor manufacturing environment
    1.
    发明授权
    System and method for integrating a dispatching system with multiple process lines in a semiconductor manufacturing environment 有权
    在半导体制造环境中将调度系统与多个生产线集成的系统和方法

    公开(公告)号:US07184852B2

    公开(公告)日:2007-02-27

    申请号:US10819680

    申请日:2004-04-07

    IPC分类号: G06F19/00

    摘要: Provided are a system and method for automatically tracking a lot being moved between first and second manufacturing lines during semiconductor manufacturing. In one example, the method includes assigning a first state to the lot to indicate the lot's presence in the first manufacturing line. A trigger event indicating that the lot has been moved to the second manufacturing line may be identified, and a second state may be determined for the lot to reflect the lot's presence in the second manufacturing line. The second state may then be assigned to the lot.

    摘要翻译: 提供了一种用于在半导体制造期间自动跟踪在第一和第二生产线之间移动的批次的系统和方法。 在一个示例中,该方法包括向批次分配第一状态以指示批次在第一生产线中的存在。 可以识别指示批次已经移动到第二生产线的触发事件,并且可以确定批次的第二状态以反映批次在第二生产线中的存在。 然后可以将第二状态分配给批次。

    Process controller for semiconductor manufacturing

    公开(公告)号:US20060025935A1

    公开(公告)日:2006-02-02

    申请号:US10899612

    申请日:2004-07-27

    IPC分类号: G01N31/00

    摘要: The present disclosure relates generally to the field of semiconductor manufacturing. In one example, in a production flow of low-volume, high-precision semiconductor products, a method for controlling critical dimensions of a semiconductor product during a semiconductor processing operation in the production flow, the semiconductor processing operation requiring a desired energy value to achieve the critical dimensions includes: measuring a previously formed critical dimension on the product; calculating a first energy value based on the measured critical dimension and a desired critical dimension for the semiconductor processing operation; and obtaining the desired energy value based on the calculated first energy value and a previously-obtained desired energy for the semiconductor processing operation performed on a prior product in the production flow.

    Method for upgrading software components without system shutdown
    3.
    发明授权
    Method for upgrading software components without system shutdown 有权
    无系统关机升级软件组件的方法

    公开(公告)号:US07146610B2

    公开(公告)日:2006-12-05

    申请号:US10400328

    申请日:2003-03-27

    申请人: You-Wei Shen

    发明人: You-Wei Shen

    IPC分类号: G06F9/44

    CPC分类号: G06F8/656

    摘要: In an operating software system that provides one or more software components for use by a plurality of software programs, a method of providing an upgraded version of a software component for use by one or more of the software programs while at the same time allowing other programs of the plurality of programs to continue to operate with the older version. The method is particularly suitable for upgrading Component Object Models (COM's) as used in the Windows® operating system.

    摘要翻译: 在提供用于由多个软件程序使用的一个或多个软件组件的操作软件系统中,提供软件组件的升级版本以供一个或多个软件程序使用的方法,同时允许其他程序 的多个程序继续使用旧版本。 该方法特别适用于在Windows(R)操作系统中使用的组件对象型号(COM)。

    Process controller for semiconductor manufacturing
    4.
    发明授权
    Process controller for semiconductor manufacturing 有权
    半导体制造工艺控制器

    公开(公告)号:US07133788B2

    公开(公告)日:2006-11-07

    申请号:US10899612

    申请日:2004-07-27

    IPC分类号: G06F19/00

    摘要: The present disclosure relates generally to the field of semiconductor manufacturing. In one example, in a production flow of low-volume, high-precision semiconductor products, a method for controlling critical dimensions of a semiconductor product during a semiconductor processing operation in the production flow, the semiconductor processing operation requiring a desired energy value to achieve the critical dimensions includes: measuring a previously formed critical dimension on the product; calculating a first energy value based on the measured critical dimension and a desired critical dimension for the semiconductor processing operation; and obtaining the desired energy value based on the calculated first energy value and a previously-obtained desired energy for the semiconductor processing operation performed on a prior product in the production flow.

    摘要翻译: 本公开一般涉及半导体制造领域。 在一个示例中,在低体积,高精度半导体产品的生产流程中,在生产流程中的半导体处理操作期间控制半导体产品的关键尺寸的方法,需要期望能量值的半导体处理操作实现 关键尺寸包括:测量产品上先前形成的关键尺寸; 基于所测量的临界尺寸和所述半导体加工操作的期望临界尺寸来计算第一能量值; 并且基于所计算的第一能量值获得期望的能量值,并且获得对于在生产流程中的现有产品执行的半导体处理操作的先前获得的期望能量。

    System and method for integrating a dispatching system with multiple process lines in a semiconductor manufacturing environment
    5.
    发明申请
    System and method for integrating a dispatching system with multiple process lines in a semiconductor manufacturing environment 有权
    在半导体制造环境中将调度系统与多个生产线集成的系统和方法

    公开(公告)号:US20050228527A1

    公开(公告)日:2005-10-13

    申请号:US10819680

    申请日:2004-04-07

    IPC分类号: G06F19/00 G06Q10/00

    摘要: Provided are a system and method for automatically tracking a lot being moved between first and second manufacturing lines during semiconductor manufacturing. In one example, the method includes assigning a first state to the lot to indicate the lot's presence in the first manufacturing line. A trigger event indicating that the lot has been moved to the second manufacturing line may be identified, and a second state may be determined for the lot to reflect the lot's presence in the second manufacturing line. The second state may then be assigned to the lot.

    摘要翻译: 提供了一种用于在半导体制造期间自动跟踪在第一和第二生产线之间移动的批次的系统和方法。 在一个示例中,该方法包括向批次分配第一状态以指示批次在第一生产线中的存在。 可以识别指示批次已经移动到第二生产线的触发事件,并且可以确定批次的第二状态以反映批次在第二生产线中的存在。 然后可以将第二状态分配给批次。

    Control of exposure energy on a substrate
    6.
    发明申请
    Control of exposure energy on a substrate 审中-公开
    控制衬底上的曝光能量

    公开(公告)号:US20050197721A1

    公开(公告)日:2005-09-08

    申请号:US10783495

    申请日:2004-02-20

    IPC分类号: G05B13/02

    CPC分类号: G05B13/042

    摘要: A method for controlling exposure energy on a wafer substrate, with a feedback process control signal of wafer thickness critical dimension, and with a feed forward process control signal of a compensation amount that compensates for thickness variations of an interlayer of the wafer substrate.

    摘要翻译: 一种用于利用晶片厚度临界尺寸的反馈过程控制信号以及用于补偿晶片衬底的中间层的厚度变化的补偿量的前馈过程控制信号来控制晶片衬底上的曝光能量的方法。