公开(公告)号：US07745923B2

公开(公告)日：2010-06-29

申请号：US11806381

申请日：2007-05-31

申请人： Yukie Hirose ,  Yasuhiro Fukuyama ,  Makoto Iwashima

发明人： Yukie Hirose ,  Yasuhiro Fukuyama ,  Makoto Iwashima

IPC分类号： H01L23/04 ,  H01R12/16 ,  H01L21/00

CPC分类号： H01L27/14618 ,  H01L27/14683 ,  H01L2924/0002 ,  H01L2924/00

摘要： A semiconductor package, includes: element substrate having first surface, including: functional element on first surface, and extracting electrode on first surface and configured to output a signal of functional element, extracting electrode being disposed around functional element; rim substrate shaped into a frame, and configured to have first junction with element substrate to surround functional element, rim substrate including: first through hole through rim substrate, and connecting electrode which is: formed by packing first through hole with first conductor material, configured to seal signal extracting aperture of extracting electrode, and configured to electrically connect signal extracting aperture with takeout electrode; and cover substrate configured to have second junction with rim substrate to block aperture of rim substrate, cover substrate including: second through hole through cover substrate, and takeout electrode which is: formed by packing second through hole with second conductor material, and configured to take out signal of functional element.

摘要翻译： 一种半导体封装件，包括：具有第一表面的元件基板，包括：第一表面上的功能元件，以及在第一表面上的提取电极，并且被配置为输出功能元件的信号，设置在功能元件周围的提取电极; 轮缘基板成形为框架，并且构造成具有与元件基板的第一接合部以围绕功能元件，边缘基板包括：第一贯通边缘基板和连接电极，其是通过用第一导体材料填充第一通孔形成的， 封闭提取电极的信号提取孔，并配置为将信号提取孔与取出电极电连接; 以及覆盖基板，被配置为具有与边缘基板的第二接合以阻挡边缘基板的孔，所述盖基板包括：通过盖基板的第二通孔，以及通过用第二导体材料填充第二通孔而形成的取出电极， 功能元件的输出信号。

公开(公告)号：US07660495B2

公开(公告)日：2010-02-09

申请号：US11312899

申请日：2005-12-20

申请人： Yukie Hirose ,  Yasuhiro Fukuyama

发明人： Yukie Hirose ,  Yasuhiro Fukuyama

IPC分类号： G02B6/00 ,  H01J7/18 ,  H01J61/26

CPC分类号： H01L23/26 ,  H01L2924/0002 ,  H01L2924/00

摘要： A getter sheet is secured within a package element in a condition of elastic deformation by positioning the getter sheet between a base and a cap of a package with at least one portion of the getter sheet in contact with the package. When positioned within the package, the condition of elastic deformation may force the getter sheet into a vaulted form. Therefore, the getter sheet may be secured within the package without utilizing any additional parts or fasteners. The getter sheet comprises particulates of a getter applied to a sheet of material. The getter sheet may comprise a rectangular shape, an elliptical shape, or an octagonal shape. The getter sheet may be secured within the package when at least one portion of the getter sheet contacts one or more of a side surface of the cap, a bottom surface of the cap, and a top surface of the base.

摘要翻译： 吸气片在弹性变形的条件下固定在包装元件内，其中吸气片位于包装的基部和盖之间，其中至少一部分吸气片与包装物接触。 当位于包装内时，弹性变形的状况可能迫使吸气片成拱形。 因此，吸气剂片材可以固定在包装内而不使用任何附加的部件或紧固件。 吸气片包括应用于一片材料的吸气剂的颗粒。 吸气片可以包括矩形，椭圆形或八角形。 当吸气片的至少一部分接触帽的侧表面，帽的底表面和基底的顶表面中的一个或多个时，吸气片可以被固定在包装内。

公开(公告)号：US20070278649A1

公开(公告)日：2007-12-06

申请号：US11806381

申请日：2007-05-31

申请人： Yukie Hirose ,  Yasuhiro Fukuyama ,  Makoto Iwashima

发明人： Yukie Hirose ,  Yasuhiro Fukuyama ,  Makoto Iwashima

IPC分类号： H01L23/48

CPC分类号： H01L27/14618 ,  H01L27/14683 ,  H01L2924/0002 ,  H01L2924/00

摘要： A semiconductor package, includes: element substrate having first surface, including: functional element on first surface, and extracting electrode on first surface and configured to output a signal of functional element, extracting electrode being disposed around functional element; rim substrate shaped into a frame, and configured to have first junction with element substrate to surround functional element, rim substrate including: first through hole through rim substrate, and connecting electrode which is: formed by packing first through hole with first conductor material, configured to seal signal extracting aperture of extracting electrode, and configured to electrically connect signal extracting aperture with takeout electrode; and cover substrate configured to have second junction with rim substrate to block aperture of rim substrate, cover substrate including: second through hole through cover substrate, and takeout electrode which is: formed by packing second through hole with second conductor material, and configured to take out signal of functional element.

摘要翻译： 一种半导体封装件，包括：具有第一表面的元件基板，包括：第一表面上的功能元件，以及在第一表面上的提取电极，并且被配置为输出功能元件的信号，设置在功能元件周围的提取电极; 轮缘基板成形为框架，并且构造成具有与元件基板的第一接合部以围绕功能元件，边缘基板包括：第一贯通边缘基板和连接电极，其是通过用第一导体材料填充第一通孔形成的， 封闭提取电极的信号提取孔，并配置为将信号提取孔与取出电极电连接; 以及覆盖基板，被配置为具有与边缘基板的第二接合以阻挡边缘基板的孔，所述盖基板包括：通过盖基板的第二通孔，以及通过用第二导体材料填充第二通孔而形成的取出电极， 功能元件的输出信号。

公开(公告)号：US20060132036A1

公开(公告)日：2006-06-22

申请号：US11312899

申请日：2005-12-20

申请人： Yukie Hirose ,  Yasuhiro Fukuyama

发明人： Yukie Hirose ,  Yasuhiro Fukuyama

IPC分类号： H01J7/18 ,  H01J61/26

CPC分类号： H01L23/26 ,  H01L2924/0002 ,  H01L2924/00

摘要： A getter sheet is secured within a package element in a condition of elastic deformation by positioning the getter sheet between a base and a cap of a package with at least one portion of the getter sheet in contact with the package. When positioned within the package, the condition of elastic deformation may force the getter sheet into a vaulted form. Therefore, the getter sheet may be secured within the package without utilizing any additional parts or fasteners. The getter sheet comprises particulates of a getter applied to a sheet of material. The getter sheet may comprise a rectangular shape, an elliptical shape, or an octagonal shape. The getter sheet may be secured within the package when at least one portion of the getter sheet contacts one or more of a side surface of the cap, a bottom surface of the cap, and a top surface of the base.

摘要翻译： 吸气片在弹性变形的条件下固定在包装元件内，其中吸气片位于包装的基部和盖之间，其中至少一部分吸气片与包装物接触。 当位于包装内时，弹性变形的状况可能迫使吸气片成拱形。 因此，吸气剂片材可以固定在包装内而不使用任何附加的部件或紧固件。 吸气片包括应用于一片材料的吸气剂的颗粒。 吸气片可以包括矩形，椭圆形或八角形。 当吸气片的至少一部分接触帽的侧表面，帽的底表面和基底的顶表面中的一个或多个时，吸气片可以被固定在包装内。