公开(公告)号：US20070284761A1

公开(公告)日：2007-12-13

申请号：US11653642

申请日：2007-01-16

申请人： Masahiro Morooka ,  Yusuke Suzuke ,  Reiko Ogura

发明人： Masahiro Morooka ,  Yusuke Suzuke ,  Reiko Ogura

IPC分类号： H01L23/29

CPC分类号： H01L23/3157 ,  H01G9/2031 ,  H01G9/2059 ,  H01G9/2077 ,  H01L31/0203 ,  H01L51/0086 ,  H01L2924/0002 ,  H01L2924/12044 ,  Y02E10/542 ,  H01L2924/00

摘要： A functional device includes plural substrates, an encapsulant arranged between the plurality of substrates, and a functional material arranged between the plural of substrates and encapsulated with the encapsulant. The functional device further includes an insulating spacer arranged in an entire region where the encapsulant lies, and the insulating spacer bonds with the plural substrates through the encapsulant.

摘要翻译： 功能器件包括多个衬底，布置在多个衬底之间的密封剂和布置在多个衬底之间并用密封剂封装的功能材料。 所述功能元件还包括布置在所述密封剂所在的整个区域中的绝缘间隔物，并且所述绝缘间隔物通过所述密封剂与所述多个基板接合。