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公开(公告)号:US5028360A
公开(公告)日:1991-07-02
申请号:US508813
申请日:1990-04-16
IPC分类号: C01B33/12 , C01B33/18 , C01B33/187
CPC分类号: C01B33/12 , C01B33/18 , C01B33/187 , C01P2002/02 , C01P2004/03 , C01P2004/10 , C01P2004/32 , C01P2004/34 , C01P2004/61 , C01P2006/10 , C01P2006/12 , C01P2006/80
摘要: A method of manufacturing spherical silica particles comprising the steps of processing in an acid-containing solution and then washing with water the coagulant derived from an aqueous alkali metal silicate solution extruded through pores in a water-miscible organic medium or acid solution, wet-grinding the amorphous silica thus obtained in a liquid dispersion medium to obtain a fine particle silica suspension with a weight average particle size of 10 .mu.m or less, spray-drying this fine particle silica suspension with hot air and sintering the spherical granulated silica thus obtained. According to the present invention, the high-purity spherical silica particles can be obtained with high solidity and adjusted surface smoothness without any complicated operation or waste water treatment for use as a sealant filler for highly-integrated IC electronic parts.
摘要翻译: 一种制造球形二氧化硅颗粒的方法,包括以下步骤:在含酸溶液中加工,然后用水洗涤衍生自水溶性有机介质或酸溶液中的孔的水性碱金属硅酸盐溶液的凝结剂,湿磨 在液体分散介质中获得的无定形二氧化硅,得到重均粒径为10μm以下的微粒二氧化硅悬浮液,用热风喷雾干燥该微粒二氧化硅悬浮液,烧结得到的球状粒状二氧化硅。 根据本发明,高纯度球形二氧化硅颗粒可以获得高固体度和调节表面平滑度,而无需任何复杂的操作或废水处理,用作高度集成的IC电子部件的密封剂填料。