公开(公告)号：US08833908B2

公开(公告)日：2014-09-16

申请号：US13248300

申请日：2011-09-29

申请人： Yimin Guan ,  Burton Joyner, II ,  Zach Reitmeier

发明人： Yimin Guan ,  Burton Joyner, II ,  Zach Reitmeier

IPC分类号： B41J2/05 ,  B41J2/16 ,  B41J2/14

CPC分类号： B41J2/14112 ,  B41J2/1601 ,  B41J2/1628 ,  B41J2/1646

摘要： Disclosed is a method for fabricating a planar heater structure for an ejection device. The method includes providing a substrate wafer having a plurality of plugs configured therewithin. The method also includes depositing and patterning a layer of a second metallic material over the substrate wafer, providing a layer of a dielectric material of a predetermined thickness over the patterned layer of the second metallic material, and conducting chemical mechanical polishing of the layer of the dielectric material to form a planarized top surface while exposing the patterned layer of the second metallic material. The method further includes cleaning the planarized top surface, depositing and patterning a resistor film over the planarized top surface, depositing one or more blanket films over the patterned resistor film, and patterning and etching the one or more blanket films. Further disclosed are planar heater structures and additional methods for fabricating the planar heater structures.

摘要翻译： 公开了一种用于制造用于喷射装置的平面加热器结构的方法。 该方法包括提供具有在其中配置的多个插头的衬底晶片。 该方法还包括在衬底晶片上沉积和图案化第二金属材料层，在第二金属材料的图案化层上提供预定厚度的电介质材料层，并对该层的第 电介质材料，以在暴露第二金属材料的图案化层的同时形成平坦化的顶表面。 该方法还包括清洁平坦化的顶表面，在平坦化的顶表面上沉积和图案化电阻器膜，在图案化的电阻膜上沉积一个或多个覆盖膜，以及图案化和蚀刻一个或多个覆盖膜。 还公开了平面加热器结构和用于制造平面加热器结构的附加方法。

公开(公告)号：US08541248B2

公开(公告)日：2013-09-24

申请号：US13248298

申请日：2011-09-29

申请人： Yimin Guan ,  Burton Joyner, II ,  Zach Reitmeier

发明人： Yimin Guan ,  Burton Joyner, II ,  Zach Reitmeier

IPC分类号： H01L21/02

CPC分类号： B41J2/14112 ,  B41J2/1601 ,  B41J2/1628 ,  B41J2/1631 ,  H01L28/20

摘要： Methods and apparatus teach a substrate wafer having a plurality of plugs configured there within. The method also includes depositing and patterning a layer of a second metallic material over the substrate wafer, providing a layer of a dielectric material of a predetermined thickness over the patterned layer of the second metallic material, and conducting chemical mechanical polishing of the layer of the dielectric material to form a planarized top surface while exposing the patterned layer of the second metallic material. The method further includes cleaning the planarized top surface, depositing and patterning a resistor film over the planarized top surface, depositing one or more blanket films over the patterned resistor film, and patterning and etching the one or more blanket films. Further disclosed are planar heater structures and additional methods for fabricating the planar heater structures.

摘要翻译： 方法和装置教导具有在其内部配置的多个插塞的衬底晶片。 该方法还包括在衬底晶片上沉积和图案化第二金属材料层，在第二金属材料的图案化层上提供预定厚度的电介质材料层，并对该层的第 电介质材料，以在暴露第二金属材料的图案化层的同时形成平坦化的顶表面。 该方法还包括清洁平坦化的顶表面，在平坦化的顶表面上沉积和图案化电阻器膜，在图案化的电阻膜上沉积一个或多个覆盖膜，以及图案化和蚀刻一个或多个覆盖膜。 还公开了平面加热器结构和用于制造平面加热器结构的附加方法。

公开(公告)号：US20130084662A1

公开(公告)日：2013-04-04

申请号：US13248298

申请日：2011-09-29

申请人： Yimin GUAN ,  Burton JOYNER, II ,  Zach REITMEIER

发明人： Yimin GUAN ,  Burton JOYNER, II ,  Zach REITMEIER

IPC分类号： H01L21/02

CPC分类号： B41J2/14112 ,  B41J2/1601 ,  B41J2/1628 ,  B41J2/1631 ,  H01L28/20

摘要： Methods and apparatus teach a substrate wafer having a plurality of plugs configured there within. The method also includes depositing and patterning a layer of a second metallic material over the substrate wafer, providing a layer of a dielectric material of a predetermined thickness over the patterned layer of the second metallic material, and conducting chemical mechanical polishing of the layer of the dielectric material to form a planarized top surface while exposing the patterned layer of the second metallic material. The method further includes cleaning the planarized top surface, depositing and patterning a resistor film over the planarized top surface, depositing one or more blanket films over the patterned resistor film, and patterning and etching the one or more blanket films. Further disclosed are planar heater structures and additional methods for fabricating the planar heater structures.

摘要翻译： 方法和装置教导具有在其内部配置的多个插塞的衬底晶片。 该方法还包括在衬底晶片上沉积和图案化第二金属材料层，在第二金属材料的图案化层上提供预定厚度的电介质材料层，并对该层的第 电介质材料，以在暴露第二金属材料的图案化层的同时形成平坦化的顶表面。 该方法还包括清洁平坦化的顶表面，在平坦化的顶表面上沉积和图案化电阻器膜，在图案化的电阻膜上沉积一个或多个覆盖膜，以及图案化和蚀刻一个或多个覆盖膜。 还公开了平面加热器结构和用于制造平面加热器结构的附加方法。

公开(公告)号：US20130083130A1

公开(公告)日：2013-04-04

申请号：US13248300

申请日：2011-09-29

申请人： YIMIN GUAN ,  Burton Joyner, II ,  Zach Reitmeier

发明人： YIMIN GUAN ,  Burton Joyner, II ,  Zach Reitmeier

IPC分类号： B41J2/05

CPC分类号： B41J2/14112 ,  B41J2/1601 ,  B41J2/1628 ,  B41J2/1646

摘要： Disclosed is a method for fabricating a planar heater structure for an ejection device. The method includes providing a substrate wafer having a plurality of plugs configured therewithin. The method also includes depositing and patterning a layer of a second metallic material over the substrate wafer, providing a layer of a dielectric material of a predetermined thickness over the patterned layer of the second metallic material, and conducting chemical mechanical polishing of the layer of the dielectric material to form a planarized top surface while exposing the patterned layer of the second metallic material. The method further includes cleaning the planarized top surface, depositing and patterning a resistor film over the planarized top surface, depositing one or more blanket films over the patterned resistor film, and patterning and etching the one or more blanket films. Further disclosed are planar heater structures and additional methods for fabricating the planar heater structures.

摘要翻译： 公开了一种用于制造用于喷射装置的平面加热器结构的方法。 该方法包括提供具有在其中配置的多个插头的衬底晶片。 该方法还包括在衬底晶片上沉积和图案化第二金属材料层，在第二金属材料的图案化层上提供预定厚度的电介质材料层，并对该层的第 电介质材料，以在暴露第二金属材料的图案化层的同时形成平坦化的顶表面。 该方法还包括清洁平坦化的顶表面，在平坦化的顶表面上沉积和图案化电阻器膜，在图案化的电阻膜上沉积一个或多个覆盖膜，以及图案化和蚀刻一个或多个覆盖膜。 还公开了平面加热器结构和用于制造平面加热器结构的附加方法。

公开(公告)号：US20120274707A1

公开(公告)日：2012-11-01

申请号：US13097594

申请日：2011-04-29

申请人： Xiaorong Cai ,  Jiandong Fang ,  Xiaoming Wu ,  Elaine Yeap Money ,  Eunki Hong ,  Yimin Guan ,  Burton Joyner, II ,  Sean Terrance Weaver ,  David Graham ,  Zach Reitmeier

发明人： Xiaorong Cai ,  Jiandong Fang ,  Xiaoming Wu ,  Elaine Yeap Money ,  Eunki Hong ,  Yimin Guan ,  Burton Joyner, II ,  Sean Terrance Weaver ,  David Graham ,  Zach Reitmeier

IPC分类号： B41J2/14 ,  B23P17/00

CPC分类号： B41J2/1628 ,  B41J2/14032 ,  B41J2/1603 ,  B41J2/1606 ,  B41J2/162 ,  B41J2/1629 ,  B41J2/1631 ,  B41J2/1639 ,  B41J2/164 ,  Y10T29/49401

摘要： Disclosed is an ejection device for an inkjet printer that includes an ejection chip having a substrate and at least one fluid ejecting element. The ejection device further includes a fluidic structure configured over the ejection chip. The fluidic structure includes a nozzle plate composed of an organic material and includes a plurality of nozzles. The fluidic structure further includes a flow feature layer configured in between the ejection chip and the nozzle plate. The flow feature layer is composed of an organic material and includes a plurality of flow features. Furthermore, the fluidic structure includes a liner layer encapsulating the nozzle plate. The liner layer further at least partially encapsulates each flow feature of the plurality of flow features. The liner layer is composed of an inorganic material. Further disclosed is a method for fabricating the ejection device.

摘要翻译： 公开了一种喷墨打印机的喷射装置，其包括具有基板和至少一个流体喷射元件的喷射芯片。 喷射装置还包括配置在喷射芯片上的流体结构。 流体结构包括由有机材料构成并包括多个喷嘴的喷嘴板。 流体结构还包括配置在喷射芯片和喷嘴板之间的流动特征层。 流动特征层由有机材料组成并且包括多个流动特征。 此外，流体结构包括封装喷嘴板的衬垫层。 衬垫层还至少部分地封装多个流动特征的每个流动特征。 衬层由无机材料构成。 进一步公开了一种制造喷射装置的方法。